Display device

ABSTRACT

A display device includes a substrate having a display area and a non-display area, a plurality of pixels in the display area, scan lines for supplying a scan signal to the pixels, the scan lines extending in a first direction, data lines for supplying a data signal to the pixels, the data lines extending in a second direction crossing the first direction, and a first dummy part in the non-display area, adjacent to an outermost pixel, connected to an outermost data line of the display area, forming a parasitic capacitor with the outermost pixel, and including a first dummy data line and a first dummy power pattern extending in parallel to the data lines.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. patent application Ser. No.16/714,545, filed Dec. 13, 2019, which is a continuation of U.S. patentapplication Ser. No. 15/976,680, filed May 10, 2018, now U.S. Pat. No.10,510,822, which claims priority to and the benefit of Korean PatentApplication No. 10-2017-0058897, filed May 11, 2017, the entire contentof both of which is incorporated herein by reference.

BACKGROUND 1. Field

An aspect of the present disclosure relates to a display device.

2. Description of the Related Art

Among display devices, an organic light emitting display device includestwo electrodes and an organic emitting layer located between the twoelectrodes. In the organic light emitting display device, electronsinjected from one electrode and holes injected from the other electrodeare combined in the organic emitting layer so as to form excitons, andthe excitons emit light through energy emission.

SUMMARY

Embodiments provide a display device having improved display quality.

According to an aspect of the present disclosure, there is provided adisplay device including a substrate having a display area and anon-display area, a plurality of pixels in the display area, scan linesfor supplying a scan signal to the pixels, the scan lines extending in afirst direction, data lines for supplying a data signal to the pixels,the data lines extending in a second direction crossing the firstdirection, and a first dummy part in the non-display area, adjacent toan outermost pixel, connected to an outermost data line of the displayarea, forming a parasitic capacitor with the outermost pixel, andincluding a first dummy data line and a first dummy power patternextending in parallel to the data lines.

Each of the pixels may include a transistor, and an organic lightemitting device connected to the transistor, the transistor including anactive pattern on the substrate, source and drain electrodes eachconnected to the active pattern, a gate electrode overlapping with theactive pattern with a gate insulating layer interposed therebetween, andan interlayer insulating layer covering the gate electrode, andincluding a first interlayer insulating layer, a second interlayerinsulating layer, and a third interlayer insulating layer, which aresequentially stacked.

The display device may further include a power line for supplying apower source to the pixels, and including a first power supply line onthe second interlayer insulating layer and parallel to the data lines,and a second power supply line on the third interlayer insulating layer,and including first lines parallel to the data lines, and second linesconnecting adjacent ones of the first lines to each other.

The data lines may be on the second interlayer insulating layer.

The scan lines may be on the gate insulating layer.

The first dummy power pattern may include a dummy first power line onthe second interlayer insulating layer, and parallel to the first powersupply line, and a dummy second power line on the third interlayerinsulating layer, parallel to the first lines of the second power supplyline, and electrically connected to the dummy first power line.

The dummy second power line may be connected to the second lines of thesecond power supply line.

Each of the pixels may further include a compensation transistorconnected to the gate electrode of the transistor, and configured to beturned on when a scan signal is supplied to a corresponding one of thescan lines to cause the transistor to be diode-connected.

Each of the pixels may further include a shielding pattern on the firstinterlayer insulating layer, and covering at least a portion of thecompensation transistor.

The shielding pattern of one of the pixels may be connected to a firstpower supply line of an adjacent pixel in a direction toward theoutermost pixel.

Each of the pixels may further include a storage capacitor including alower electrode on the gate insulating layer, and an upper electrode onthe first interlayer insulating layer.

The first dummy part may further include a dummy semiconductor patternon the same layer as the active pattern, and extending parallel to thefirst dummy data line, and a first dummy shielding pattern on the firstinterlayer insulating layer, connected to the dummy first power line,and covering at least a portion of the compensation transistor of theoutermost pixel.

The display area may include a first display area in which lengths ofthe scan lines are the same, and a second display area at at least oneside of the first display area, and in which lengths of respective onesof the scan lines decrease as the scan lines become more distant fromthe first display area.

The first dummy part may be in the non-display area corresponding to thefirst display area.

The display device may further include a second dummy part in thenon-display area adjacent to an outermost pixel of the second displayarea, and forming a parasitic capacitor with the outermost pixel of thesecond display area.

The second dummy part may include a second dummy data line and a seconddummy power pattern, which extend in parallel to the data lines.

The second dummy data line and the second dummy power pattern may have ashape extending from a data line and a first power line, which areconnected to a pixel connected to one of the scan lines that is moreadjacent to the first display area than another of the scan lines thatis connected to the outermost pixel.

The second dummy part may further include a second dummy shieldingpattern on the first interlayer insulating layer, and connected to thesecond dummy power pattern.

The second dummy shielding pattern may cover the compensation transistorof the outermost pixel of the second display area.

A width of the second dummy part in the first direction may be less thanthat of each pixel.

A width of the first dummy part in the first direction may be less thanthat of each pixel.

According to an aspect of the present disclosure, there is provided adisplay device including a substrate including a display area and anon-display area, a plurality of pixels in the display area and eachincluding an organic light emitting device, a driving transistorconnected to the organic light emitting device, and a compensationtransistor for compensating for a threshold voltage of the drivingtransistor, scan lines for supplying a scan signal to the pixels, andextending in a first direction, data lines for supplying a data signalto the pixels, and extending in a second direction crossing the firstdirection at a respective side of the pixels, and a first dummy part atanother side of an outermost pixel opposite a respective one of the datalines, connected to an outermost data line of the display area, forminga parasitic capacitor with the outermost pixel, including a first dummydata line and a first dummy power pattern, which extend in parallel tothe data lines, and forming a parasitic capacitor with the drivingtransistor and the compensation transistor.

The first dummy part and the compensation transistor of the outermostpixel may be adjacent to each other.

A distance between the first dummy part and the compensation transistorof the outermost pixel may be less than that between the compensationtransistor of the outermost pixel and the outermost data line.

The compensation transistor may be connected to a gate electrode of thedriving transistor, and is turned on when a scan signal is supplied tocause the driving transistor to be diode-connected.

The driving transistor may include an active pattern on the substrate,source and drain electrodes each connected to the active pattern, a gateelectrode overlapping with the active pattern with a gate insulatinglayer interposed therebetween, and an interlayer insulating layercovering the gate electrode, and including a first interlayer insulatinglayer, a second interlayer insulating layer, and a third interlayerinsulating layer, which are sequentially stacked.

The display device may further include a power line for supplying apower source to the pixels, and including a first power supply line onthe second interlayer insulating layer, and parallel to the data lines,and a second power supply line on the third interlayer insulating layer,and including first lines parallel to the data lines, and second linesconnecting adjacent ones of the first lines to each other.

The first dummy power pattern may include a dummy first power line onthe second interlayer insulating layer, and parallel to the first powersupply line, and a dummy second power line on the third interlayerinsulating layer, parallel to the first lines, and electricallyconnected to the dummy first power line.

The dummy second power line may be connected to the second lines.

Each of the pixels may further include a shielding pattern on the firstinterlayer insulating layer, and covering at least a portion of thecompensation transistor.

The shielding pattern of one of the pixels may be connected to the firstpower supply line of an adjacent pixel in a direction toward theoutermost pixel.

The first dummy part may further include a dummy semiconductor patternon the same layer as the active pattern, and extending in a directionparallel to the first dummy data line, and a first dummy shieldingpattern on the first interlayer insulating layer, connected to the dummyfirst power line, and covering at least a portion of the compensationtransistor of the outermost pixel.

The display area may include a first display area in which lengths ofthe scan lines are the same, and a second display area at at least oneside of the first display area, in which lengths of respective ones ofthe scan lines decrease as the scan lines become more distant from thefirst display area.

The first dummy part may be in the non-display area corresponding to thefirst display area.

The display device may further include a second dummy part in thenon-display area, adjacent to an outermost pixel of the second displayarea, forming a parasitic capacitor with the outermost pixel of thesecond display area, and including a second dummy data line and a seconddummy power pattern, which extend in parallel to the data lines.

The second dummy data line and the second dummy power pattern may have ashape extending from a data line and a first power line, which areconnected to a pixel connected to one of the scan lines that is moreadjacent to the first display area than another of the scan lines thatis connected to the outermost pixel.

The second dummy part may further include a second dummy shieldingpattern on the first interlayer insulating layer, and connected to thesecond dummy power pattern.

The second dummy shielding pattern may cover the compensation transistorof the outermost pixel of the second display area.

A width of the second dummy part in the first direction may be less thanthat of each pixel.

A distance between the second dummy part and the compensation transistorof the outermost pixel of the second display area may be less than thatbetween the compensation transistor of the outermost pixel and theoutermost data line.

A width of the first dummy part in the first direction may be less thanthat of each pixel.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a plan view illustrating a display device according to anembodiment of the present disclosure.

FIG. 2 is a block diagram illustrating an embodiment of pixels and adriving unit according to an embodiment of the present disclosure.

FIG. 3 is an equivalent circuit diagram illustrating an embodiment ofthe pixel shown in FIG. 2 .

FIG. 4 is an enlarged view of area EA1 of FIG. 1 .

FIG. 5 is an enlarged view of a pixel connected to an ith scan line andan mth data line, which are shown in FIG. 4 .

FIG. 6 is a cross-sectional view taken along the line I-I′ of FIG. 5 .

FIG. 7 is a cross-sectional view taken along the line II-II′ of FIG. 5 .

FIG. 8 is an enlarged view of a first dummy part connected to the ithscan line shown in FIG. 4 .

FIG. 9 is a cross-sectional view taken along the line III-III′ of FIG. 8.

FIGS. 10 and 11 are plan views illustrating an outermost pixel, a dataline, and a first dummy part.

FIG. 12 is a plan view illustrating active patterns, source electrodes,and drain electrodes, which are shown in FIGS. 4 to 10 .

FIG. 13 is a plan view illustrating scan lines, emission control lines,and a lower electrode of a storage capacitor, which are shown in FIGS. 4to 10 .

FIG. 14 is a plan view illustrating an initialization power line and anupper electrode of the storage capacitor, which are shown in FIGS. 4 to10 .

FIG. 15 is a plan view illustrating data lines, a connection line, anauxiliary connection line, a first power supply line of a power line,and a first bridge pattern, which are shown in FIGS. 4 to 10 .

FIG. 16 is a plan view illustrating data lines, a second power supplyline of the power line, a connection line, an extension region, and asecond bridge pattern, which are shown in FIGS. 4 to 10 .

FIG. 17 is a plan view illustrating an organic light emitting deviceshown in FIGS. 4 to 10 .

FIG. 18 is an enlarged view of area EA2 of FIG. 1 .

FIG. 19 is an enlarged view of a second dummy part shown in FIG. 18 .

FIG. 20 is a cross-sectional view taken along the line IV-IV′ of FIG. 19.

DETAILED DESCRIPTION

Features of the inventive concept and methods of accomplishing the samemay be understood more readily by reference to the following detaileddescription of embodiments and the accompanying drawings. Hereinafter,embodiments will be described in more detail with reference to theaccompanying drawings, in which like reference numbers refer to likeelements throughout. The present invention, however, may be embodied invarious different forms, and should not be construed as being limited toonly the illustrated embodiments herein. Rather, these embodiments areprovided as examples so that this disclosure will be thorough andcomplete, and will fully convey the aspects and features of the presentinvention to those skilled in the art. Accordingly, processes, elements,and techniques that are not necessary to those having ordinary skill inthe art for a complete understanding of the aspects and features of thepresent invention may not be described. Unless otherwise noted, likereference numerals denote like elements throughout the attached drawingsand the written description, and thus, descriptions thereof will not berepeated. In the drawings, the relative sizes of elements, layers, andregions may be exaggerated for clarity.

In the following description, for the purposes of explanation, numerousspecific details are set forth to provide a thorough understanding ofvarious embodiments. It is apparent, however, that various embodimentsmay be practiced without these specific details or with one or moreequivalent arrangements. In other instances, well-known structures anddevices are shown in block diagram form in order to avoid unnecessarilyobscuring various embodiments.

It will be understood that, although the terms “first,” “second,”“third,” etc., may be used herein to describe various elements,components, regions, layers and/or sections, these elements, components,regions, layers and/or sections should not be limited by these terms.These terms are used to distinguish one element, component, region,layer or section from another element, component, region, layer orsection. Thus, a first element, component, region, layer or sectiondescribed below could be termed a second element, component, region,layer or section, without departing from the spirit and scope of thepresent invention.

Spatially relative terms, such as “beneath,” “below,” “lower,” “under,”“above,” “upper,” and the like, may be used herein for ease ofexplanation to describe one element or feature's relationship to anotherelement(s) or feature(s) as illustrated in the figures. It will beunderstood that the spatially relative terms are intended to encompassdifferent orientations of the device in use or in operation, in additionto the orientation depicted in the figures. For example, if the devicein the figures is turned over, elements described as “below” or“beneath” or “under” other elements or features would then be oriented“above” the other elements or features. Thus, the example terms “below”and “under” can encompass both an orientation of above and below. Thedevice may be otherwise oriented (e.g., rotated 90 degrees or at otherorientations) and the spatially relative descriptors used herein shouldbe interpreted accordingly.

It will be understood that when an element, layer, region, or componentis referred to as being “on,” “connected to,” or “coupled to” anotherelement, layer, region, or component, it can be directly on, connectedto, or coupled to the other element, layer, region, or component, or oneor more intervening elements, layers, regions, or components may bepresent. However, “directly connected/directly coupled” refers to onecomponent directly connecting or coupling another component without anintermediate component. Meanwhile, other expressions describingrelationships between components such as “between,” “immediatelybetween” or “adjacent to” and “directly adjacent to” may be construedsimilarly. In addition, it will also be understood that when an elementor layer is referred to as being “between” two elements or layers, itcan be the only element or layer between the two elements or layers, orone or more intervening elements or layers may also be present.

For the purposes of this disclosure, expressions such as “at least oneof,” when preceding a list of elements, modify the entire list ofelements and do not modify the individual elements of the list. Forexample, “at least one of X, Y, and Z” and “at least one selected fromthe group consisting of X, Y, and Z” may be construed as X only, Y only,Z only, or any combination of two or more of X, Y, and Z, such as, forinstance, XYZ, XYY, YZ, and ZZ. Like numbers refer to like elementsthroughout. As used herein, the term “and/or” includes any and allcombinations of one or more of the associated listed items.

The terminology used herein is for the purpose of describing particularembodiments only and is not intended to be limiting of the presentinvention. As used herein, the singular forms “a” and “an” are intendedto include the plural forms as well, unless the context clearlyindicates otherwise. It will be further understood that the terms“comprises,” “comprising,” “have,” “having,” “includes,” and“including,” when used in this specification, specify the presence ofthe stated features, integers, steps, operations, elements, and/orcomponents, but do not preclude the presence or addition of one or moreother features, integers, steps, operations, elements, components,and/or groups thereof. As used herein, the term “and/or” includes anyand all combinations of one or more of the associated listed items.

As used herein, the term “substantially,” “about,” “approximately,” andsimilar terms are used as terms of approximation and not as terms ofdegree, and are intended to account for the inherent deviations inmeasured or calculated values that would be recognized by those ofordinary skill in the art. “About” or “approximately,” as used herein,is inclusive of the stated value and means within an acceptable range ofdeviation for the particular value as determined by one of ordinaryskill in the art, considering the measurement in question and the errorassociated with measurement of the particular quantity (i.e., thelimitations of the measurement system). For example, “about” may meanwithin one or more standard deviations, or within ±30%, 20%, 10%, 5% ofthe stated value. Further, the use of “may” when describing embodimentsof the present invention refers to “one or more embodiments of thepresent invention.” As used herein, the terms “use,” “using,” and “used”may be considered synonymous with the terms “utilize,” “utilizing,” and“utilized,” respectively. Also, the term “exemplary” is intended torefer to an example or illustration.

When a certain embodiment may be implemented differently, a specificprocess order may be performed differently from the described order. Forexample, two consecutively described processes may be performedsubstantially at the same time or performed in an order opposite to thedescribed order.

Various embodiments are described herein with reference to sectionalillustrations that are schematic illustrations of embodiments and/orintermediate structures. As such, variations from the shapes of theillustrations as a result, for example, of manufacturing techniquesand/or tolerances, are to be expected. Further, specific structural orfunctional descriptions disclosed herein are merely illustrative for thepurpose of describing embodiments according to the concept of thepresent disclosure. Thus, embodiments disclosed herein should not beconstrued as limited to the particular illustrated shapes of regions,but are to include deviations in shapes that result from, for instance,manufacturing. For example, an implanted region illustrated as arectangle will, typically, have rounded or curved features and/or agradient of implant concentration at its edges rather than a binarychange from implanted to non-implanted region. Likewise, a buried regionformed by implantation may result in some implantation in the regionbetween the buried region and the surface through which the implantationtakes place. Thus, the regions illustrated in the drawings are schematicin nature and their shapes are not intended to illustrate the actualshape of a region of a device and are not intended to be limiting.

The electronic or electric devices and/or any other relevant devices orcomponents according to embodiments of the present invention describedherein may be implemented utilizing any suitable hardware, firmware(e.g. an application-specific integrated circuit), software, or acombination of software, firmware, and hardware. For example, thevarious components of these devices may be formed on one integratedcircuit (IC) chip or on separate IC chips. Further, the variouscomponents of these devices may be implemented on a flexible printedcircuit film, a tape carrier package (TCP), a printed circuit board(PCB), or formed on one substrate. Further, the various components ofthese devices may be a process or thread, running on one or moreprocessors, in one or more computing devices, executing computer programinstructions and interacting with other system components for performingthe various functionalities described herein. The computer programinstructions are stored in a memory which may be implemented in acomputing device using a standard memory device, such as, for example, arandom access memory (RAM). The computer program instructions may alsobe stored in other non-transitory computer readable media such as, forexample, a CD-ROM, flash drive, or the like. Also, a person of skill inthe art should recognize that the functionality of various computingdevices may be combined or integrated into a single computing device, orthe functionality of a particular computing device may be distributedacross one or more other computing devices without departing from thespirit and scope of the exemplary embodiments of the present invention.

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by oneof ordinary skill in the art to which the present invention belongs. Itwill be further understood that terms, such as those defined in commonlyused dictionaries, should be interpreted as having a meaning that isconsistent with their meaning in the context of the relevant art and/orthe present specification, and should not be interpreted in an idealizedor overly formal sense, unless expressly so defined herein.

FIG. 1 is a plan view illustrating a display device according to anembodiment of the present disclosure.

Referring to FIG. 1 , the display device according to the presentdisclosure may include a substrate SUB, pixels PXL provided on thesubstrate SUB, a driving unit that is provided on the substrate SUB anddrives the pixels PXL, and a line unit that allows the pixels PXL andthe driving unit to be connected to each other therethrough.

The substrate SUB may have various shapes. For example, the substrateSUB may have a closed polygonal shape including linear sides. Thesubstrate SUB may also have a shape such as a circle or ellipseincluding curved sides. The substrate SUB may also have a shape such asa semicircle or semi-ellipse including both linear and curved sides. Inan embodiment of the present disclosure, when the substrate SUB haslinear sides, at least some corners of each of the shapes may be formedin a curve. For example, when the substrate SUB has a rectangular shape,a portion at which adjacent linear sides meet each other may be replacedwith a curve (e.g., a curve having a predetermined curvature). That is,a vertex portion of the rectangular shape may be formed with a curvedside having both adjacent ends respectively connected to two adjacentlinear sides (e.g., the curved side may have a predetermined curvature).The curvature may be differently set depending on positions. Forexample, the curvature may be changed depending on a position at whichthe curve is started, a length of the curve, etc.

When the substrate SUB includes a plurality of areas, each area may alsobe provided in various shapes, such as a closed polygon including linearsides, a circle and an ellipse, including curved sides, and a semicircleand a semi-ellipse, including linear and curved sides.

The substrate SUB may include a display area PXA and a non-display areaPPA.

The display area PXA is an area in which the pixels PXL that display animage are provided. Embodiments of the pixel PXL will be describedlater. The display area PXA may have various shapes. For example, thedisplay area PXA may have a shape corresponding to the substrate SUB.

For example, the display area PXA may have a closed polygonal shapeincluding linear sides. The display area PXA may also have a shape suchas a circle or ellipse including curved sides. The display area PXA mayalso have a shape such as a semicircle or semi-ellipse including linearand curved sides. In an embodiment of the present disclosure, when thedisplay area PXA has linear sides, at least some of corners of each ofthe shapes may be formed in a curve. For example, when the display areaPXA has a rectangular shape, a portion at which adjacent linear sidesmeet each other may be replaced with a curve (e.g., a curve having apredetermined curvature). That is, a vertex portion of the rectangularshape may be formed with a curved side having both adjacent endsrespectively connected to two adjacent linear sides. The curvature maybe differently set depending on positions. For example, the curvaturemay be changed depending on a position at which the curve is started, alength of the curve, etc.

In an embodiment of the present disclosure, the display area PXA mayinclude a first display area PXA1 and two second display areas PXA2.Each of the second display areas PXA2 may have a shape in which thewidth of the second display area PXA2 becomes narrower as the seconddisplay area PXA2 becomes more distant from the first display area PXA1(e.g., becomes narrower in a direction away from the first display areaPXA1). For example, each of the second display areas PXA2 may have atrapezoidal shape in which the width of the second display area PXA2becomes narrower as the second display area PXA2 becomes more distantfrom the first display area PXA1.

The non-display area PPA is an area in which no image is displayed, asthe non-display area PPA may be an area in which the pixels PXL are notprovided. The driving unit may drive the pixels PXL, and lines of theline unit allow the pixels PXL and the driving unit to be connected toeach other therethrough. The non-display area PPA corresponds to a bezelin a final display device, and the width of the bezel may be determinedaccording to the width of the non-display area PPA.

The non-display area PPA may be provided at at least one side of thedisplay area PXA. In an embodiment of the present disclosure, thenon-display area PPA may surround the circumference of the display areaPXA. In an embodiment of the present disclosure, the non-display areaPPA may include a lateral part extending in the width direction thereof,and a longitudinal part extending the length direction thereof. Thelongitudinal part of the non-display area PPA may be provided as a pairof parts that are spaced apart from each other along the width directionof the display area PXA.

The pixels PXL may be provided in the display area PXA on the substrateSUB. Each of the pixels PXL is a minimum unit for displaying an image,and may be provided in plural. Each of the pixels PXL may include alight emitting device that emits white light and/or colored light. Eachpixel PXL may emit light of any one color among red, green, and blue,but the present disclosure is not limited thereto. For example, thepixel PXL may also emit light of any one color among cyan, magenta,yellow, and white.

The pixels PXL may be arranged in a matrix form along a plurality ofrows extending in a first direction DR1, and a plurality of columnsextending in a second direction DR2. In an embodiment of the presentdisclosure, the arrangement of the pixels PXL is not particularlylimited, and the pixels PXL may be arranged in various forms. Forexample, some of the pixels PXL may be arranged such that the firstdirection DR1 becomes the row direction, but others of the pixels PXLmay be arranged such that the row direction becomes a directiondifferent from the first direction DR1 (e.g., becomes a directionoblique to the first direction DR1).

Each of the pixels PXL may include, as a display element, an organiclight emitting device including an organic emitting layer, but thepresent disclosure is not limited thereto. For example, each of thepixels PXL may include various types of display elements, such as aliquid crystal element, an electrophoretic element, and anelectrowetting element.

The driving unit provides signals to each pixel PXL through the lines,and accordingly controls driving of the pixels PXL. In FIG. 1 , the lineunit is omitted for convenience of description, but will be describedlater.

The driving unit may include a scan driver SDV that provides a scansignal to the pixels PXL through scan lines, an emission driver EDV thatprovides an emission control signal to the pixels PXL through emissioncontrol lines, a data driver DDV that provides a data signal to thepixels PXL through data lines, and a timing controller. The timingcontroller may control the scan driver SDV, the emission driver EDV, andthe data driver DDV.

The scan driver SDV may be provided at the longitudinal part of thenon-display area PPA. The longitudinal part of the non-display area PPAis provided as a pair of parts that are spaced apart from each otheralong the width direction of the display area PXA, and therefore, thescan driver SDV may be provided at at least one of the longitudinalparts of the non-display area PPA. The scan driver SDV may extend alongthe length direction of the non-display area PPA.

In an embodiment of the present disclosure, the scan driver SDV may bedirectly mounted on the substrate SUB. When the scan driver SDV isdirectly mounted on the substrate SUB, the scan driver SDV may be formedtogether with the pixels PXL in a process of forming the pixels PXL, butthe present disclosure is not limited thereto. For example, the scandriver SDV may be formed on a separate chip to be provided in achip-on-glass manner on the substrate SUB. Also, the scan driver SDV maybe formed on a separated chip and then mounted on a printed circuitboard, and may then be connected to the substrate SUB through aconnection member such as a flexible printed circuit board.

Similar to the scan driver SDV, the emission driver EDV may be providedat the longitudinal part of the non-display area PPA. The emissiondriver EDV may be provided at at least one of the pair of longitudinalparts of the non-display area PPA. The emission driver EDV may extendalong the length direction of the non-display area PPA.

In an embodiment of the present disclosure, the emission driver EDV maybe directly mounted on the substrate SUB. When the emission driver EDVis directly mounted on the substrate SUB, the emission driver EDV may beformed together with the pixels PXL in a process of forming the pixelsPXL, but the present disclosure is not limited thereto. For example, theemission driver EDV may be formed on a separate chip to be provided in achip-on-glass manner on the substrate SUB. Also, the emission driver EDVmay be formed on a separated chip, and may then be mounted on a printedcircuit board, and may be connected to the substrate SUB through aconnection member such as a flexible printed circuit board.

In an embodiment of the present disclosure, a case where the scan driverSDV and the emission driver EDV are adjacent to each other and areformed at only one of any side between the pair of longitudinal parts ofthe non-display area PPA is illustrated as an example. However, thepresent disclosure is not limited thereto, and the arrangement of thescan driver SDV and the emission driver EDV may be changed in variousmanners. For example, the scan driver SDV may be provided at one of thelongitudinal parts of the non-display area PPA, and the emission driverEDV may be provided at the other of the longitudinal parts of thenon-display area PPA. Alternatively, the scan driver SDV (e.g.,different parts thereof) may be provided at both of the longitudinalparts of the non-display area PPA, and the emission driver EDV may beprovided at only one of the longitudinal parts of the non-display areaPPA.

The data driver DDV may be located in the non-display area PPA. Forexample, the data driver DDV may be located at the lateral part of thenon-display area PPA. The data driver DDV may extend along the widthdirection of the non-display area PPA.

In an embodiment of the present disclosure, the positions of the scandriver SDV, the emission driver EDV, and/or the data driver DDV may bechanged, if suitable.

The timing controller may be connected in various manners to the scandriver SDV, the emission driver EDV, and the data driver DDV through thelines. The position at which the timing controller is located is notparticularly limited. For example, the timing controller may be mountedon a printed circuit board, to be connected to the scan driver SDV, theemission driver EDV, and the data driver DDV through a flexible printedcircuit board. The printed circuit board may be located at variouspositions, such as at a side of the substrate SUB, or at a back surfaceof the substrate SUB.

FIG. 2 is a block diagram illustrating an embodiment of the pixels andthe driving unit according to the present embodiment.

Referring to FIG. 2 , the display device according to the presentembodiment may include pixels PXL, a driving unit, and a line unit.

The pixels PXL may include a plurality of pixels. The driving unit mayinclude a scan driver SDV, an emission driver EDV, a data driver DDV,and a timing controller TC. In FIG. 2 , positions of the scan driverSDV, the emission driver EDV, the data driver DDV, and the timingcontroller TC are set for convenience of description, but the presentdisclosure is not limited thereto. When an actual display device isimplemented, the scan driver SDV, the emission driver EDV, the datadriver DDV, and the timing controller TC may be located at positionsdifferent from those shown in FIG. 2 in the display device.

The line unit provides signals from the driving unit to each pixel PXL,and may include scan lines S1 to Sn, data lines D1 to Dm, emissioncontrol lines E1 to En, a power line PL, and a first initializationpower line Vint. The scan lines may include a plurality of scan lines S1to Sn, and the emission control lines may include a plurality ofemission control lines E1 to En. The data lines may include a pluralityof data lines D1 to Dm. The data lines D1 to Dm and the power line PLmay be connected to the pixels PXL.

The pixels PXL may be arranged in the display area PXA shown in FIG. 1 .The pixels PXL may be connected to respective ones of the scan lines S1to Sn, the emission control lines E1 to En, and the data lines D1 to Dm,and may be connected to the power line PL. The pixels PXL may besupplied with a data signal from the data lines D1 to Dm when a scansignal is supplied from the scan lines S1 to Sn.

In addition, the pixels PXL may be supplied with a first power sourceELVDD, a second power source ELVSS, and an initialization power sourceVint, which may be externally supplied. Here, the first power sourceELVDD may be applied through the power line PL.

Each of the pixels PXL may at least include a driving transistor and anorganic light emitting diode. The driving transistor may control theamount of current flowing from the first power source ELVDD to thesecond power source ELVSS via the organic light emitting diode,corresponding to a data signal. Here, before the data signal issupplied, a gate electrode of the driving transistor may be initializedby the voltage of the initialization power source Vint. To this end, theinitialization power source Vint may be set to a voltage that is lowerthan the data signal.

The scan driver SDV may supply the scan signal to the scan lines S1 toSn in response to a first gate control signal GCS1 from the timingcontroller TC. For example, the scan driver SDV may sequentially supplythe scan signal to the scan lines S1 to Sn. If the scan signal issequentially supplied to the scan lines S1 to Sn, the pixels PXL may besequentially selected in units of horizontal lines.

The emission driver EDV may supply the emission control signal to theemission control lines E1 to En in response to a second gate controlsignal GCS2 from the timing controller TC. For example, the emissiondriver EDV may sequentially supply the emission control signal to theemission control lines E1 to En.

Here, the emission control signal may be set to have a width that iswider than that of the scan signal. For example, the emission controlsignal supplied to an ith (i is a natural number) emission control lineEi may be supplied to overlap with, for at least a partial period, boththe scan signal supplied to an (i−1)th first scan line Si−1 and the scansignal supplied to an ith scan line Si.

Additionally, the emission control signal may be set to a gate-offvoltage (e.g., a high voltage) such that corresponding transistorsincluded in the pixels PXL can be turned off, and the scan signal may beset to a gate-on voltage (e.g., a low voltage) such that correspondingtransistors included in the pixels PXL can be turned on.

The data driver DDV may supply the data signal to the data lines D1 toDm in response to a data control signal DCS. The data signal supplied tothe data lines D1 to Dm may be supplied to pixels PXL selected by thescan signal.

The timing controller TC may respectively supply, to the scan driver SDVand the emission driver EDV, the gate control signals GCS1 and GCS2generated based on externally supplied timing signals. Also, the timingcontroller TC may supply the data control signal DCS to the data driverDDV.

A start pulse and clock signals may be included in each of the gatecontrol signals GCS1 and GCS2. The start pulse may control a timing of afirst scan signal or a first emission control signal. The clock signalsmay be used to shift the start pulse.

A source start pulse and clock signals may be included in the datacontrol signal DCS. The source start pulse may control a sampling starttime of data (e.g., a data sampling start time). The color signals maybe used to control a sampling operation of the data.

FIG. 3 is an equivalent circuit diagram illustrating an embodiment ofthe pixel shown in FIG. 2 . For convenience of description, a pixelconnected to a jth data line Dj and an ith scan line Si is illustratedin FIG. 3 .

Referring to FIGS. 2 and 3 , the pixel PXL according to the presentembodiment may include an organic light emitting device OLED, a firsttransistor T1, a second transistor T2, a third transistor T3, a fourthtransistor T4, a fifth transistor T5, a sixth transistor T6, a seventhtransistor T7, and a storage capacitor Cst.

An anode of the organic light emitting device OLED may be connected tothe first transistor T1 via the sixth transistor T6, and a cathode ofthe organic light emitting device OLED may be connected to the secondpower source ELVSS. The organic light emitting device OLED may generatelight (e.g., with a predetermined luminance) corresponding to the amountof current supplied from the first transistor T1.

The first power source ELVDD may be set to a voltage that is higher thanthat of the second power source ELVSS such that current can flow in theorganic light emitting device OLED.

The seventh transistor T7 may be connected between the initializationpower source Vint and the anode of the organic light emitting deviceOLED. In addition, a gate electrode of the seventh transistor T7 may beconnected to the ith scan line Si. The seventh transistor T7 may beturned on when a scan signal is supplied to the ith scan line Si, tosupply the voltage of the initialization power source Vint to the anodeof the organic light emitting device OLED. Here, the initializationpower source Vint may be set to a voltage that is lower than a datasignal.

The sixth transistor T6 may be connected between the first transistor T1and the organic light emitting device OLED. In addition, a gateelectrode of the sixth transistor T6 may be connected to an ith emissioncontrol line Ei. The sixth transistor T6 may be turned off when anemission control signal is supplied to the ith emission control line Ei,and may be turned on otherwise.

The fifth transistor T5 may be connected between the first power sourceELVDD and the first transistor T1. In addition, a gate electrode of thefifth transistor T5 may be connected to the ith emission control lineEi. The fifth transistor T5 may be turned off when the emission controlsignal is supplied to the ith emission control line Ei, and may beturned on otherwise.

A first electrode of the first transistor (drive transistor) T1 may beconnected to the first power source ELVDD via the fifth transistor T5,and a second electrode of the first transistor T1 may be connected tothe anode of the organic light emitting device OLED via the sixthtransistor T6. In addition, a gate electrode of the first transistor T1may be connected to a first node N1. The first transistor T1 may controlthe amount of current flowing from the first power source ELVDD to thesecond power source ELVSS via the organic light emitting device OLED,corresponding to a voltage of the first node N1. That is, the firstpower source ELVDD may be electrically connected to the anode of theorganic light emitting device OLED through the first transistor T1.

The third transistor T3 may be connected between the second electrode ofthe first transistor T1 and the first node N1. In addition, a gateelectrode of the third transistor T3 may be connected to the ith scanline Si. The third transistor T3 may be turned on when a scan signal issupplied to the ith scan line Si to allow the second electrode of thefirst transistor T1 to be electrically connected to the first node N1.Therefore, when the third transistor T3 is turned on, the firsttransistor T1 may be diode-connected, and the third transistor T3 maycompensate for a threshold voltage of the first transistor T1. That is,the third transistor T3 may be a compensation transistor thatcompensates for the threshold voltage of the first transistor T1.

The fourth transistor T4 may be connected between the first node N1 andthe initialization power source Vint. In addition, a gate electrode ofthe fourth transistor T4 may be connected to an (i−1)th scan line Si−1.The fourth transistor T4 may be turned on when a scan signal is suppliedto the (i−1)th scan line Si−1, to supply the voltage of theinitialization power source Vint to the first node N1.

The second transistor T2 may be connected between the jth data line Djand the first electrode of the first transistor T1. In addition, a gateelectrode of the second transistor T2 may be connected to the ith scanline Si. The second transistor T2 may be turned on when a scan signal issupplied to the ith scan line Si to allow the jth data line Dj to beelectrically connected to the first electrode of the first transistorT1.

The storage capacitor Cst may be connected between the first powersource ELVDD and the first node N1. The storage capacitor Cst may storea voltage corresponding to the data signal and the threshold voltage ofthe first transistor T1.

FIG. 4 is an enlarged view of area EA1 of FIG. 1 . FIG. 5 is an enlargedview of a pixel connected to an ith scan line and an mth data line,which are shown in FIG. 4 . FIG. 6 is a cross-sectional view taken alongthe line I-I′ of FIG. 5 . FIG. 7 is a cross-sectional view taken alongthe line II-II′ of FIG. 5 . FIG. 8 is an enlarged view of a first dummypart connected to the ith scan line shown in FIG. 4 . FIG. 9 is across-sectional view taken along the line III-III′ of FIG. 8 . FIGS. 10and 11 are plan views illustrating an outermost pixel, a data line, anda first dummy part.

Referring to FIGS. 1 to 11 , the display device may include a substrateSUB including a display area PXA and a non-display area PPA, pixels PXLprovided in the display area PXA, and a line unit that provides signalsto the pixels PXL.

The substrate SUB may include a transparent insulating material toenable light to be transmitted therethrough. The substrate SUB may be arigid substrate. For example, the substrate SUB may be one of a glasssubstrate, a quartz substrate, a glass ceramic substrate, and acrystalline glass substrate.

In addition, the substrate SUB may be a flexible substrate. Here, thesubstrate SUB may be one of a film substrate and a plastic substrateincluding a polymer organic material. For example, the substrate SUB mayinclude at least one of polystyrene, polyvinyl alcohol, polymethylmethacrylate, polyethersulfone, polyacrylate, polyetherimide,polyethylene naphthalate, polyethylene terephthalate, polyphenylenesulfide, polyarylate, polyimide, polycarbonate, triacetate cellulose,and cellulose acetate propionate. However, the material constituting thesubstrate SUB may be variously changed, and may include a fiberreinforced plastic (FRP), etc.

The line unit may provide signals to each of the pixels PXL. The lineunit may include scan lines Si−1, Si, and Si+1, data lines Dm−1 and Dm,emission control lines E and Ei+1, a power line PL, and aninitialization power line IPL.

The scan lines Si−1, Si, and Si+1 may extend in the first direction DR1.The scan lines Si−1, Si, and Si+1 may have a shape extending from one tothe other of portions of the non-display area PPA, which are located atboth sides of the display area PXA. The scan lines Si−1, Si, and Si+1may include an (i−1)th scan line Si−1, an ith scan line Si, and an(i+1)th scan line Si+1, which are sequentially arranged along the seconddirection DR2. The scan lines Si−1, Si, and Si+1 may be applied withscan signals. For example, the (i−1)th scan line Si−1 may be appliedwith an (i−1)th scan signal. Pixels PXL connected to the ith scan lineSi may be initialized by the (i−1)th scan signal applied to the (i−1)thscan line Si−1. The ith scan line Si may be applied with an ith scansignal. The ith scan line Si may branch off to be connected to differenttransistors. Pixels PXL connected to the (i+1)th scan line Si+1 may beinitialized by the ith scan signal applied to the ith scan line Si. The(i+1)th scan line Si+1 may be applied with an (i+1)th scan signal. The(i+1)th scan line Si+1 may branch off to be connected to differenttransistors.

The emission control lines Ei and Ei+1 may extend in the first directionDR1. The emission control lines Ei and Ei+1 may have a shape extendingfrom one to the other of portions of the non-display area PPA, which arelocated at both sides of the display area PXA. The emission controllines Ei and Ei+1 may be located to be spaced apart from the scan linesSi−1, Si, and Si+1. The emission control lines Ei and Ei+1 may beapplied with emission control signals.

The data lines Dm−1 and Dm may extend in the second direction DR2. Thedata lines Dm−1 and Dm may be applied with data signals. Each of thedata lines Dm−1 and Dm may be provided at a respective side ofcorresponding pixels PXL.

The power line PL may have a lattice shape (e.g., a grid or matrixshape). For example, a portion of the power line PL may extend in thesecond direction DR2, and the rest of the power line PL may extend in adirection crossing the second direction DR2. The power line PL may beapplied with the first power source (see “ELVDD” of FIGS. 2 and 3 ).

The initialization power line IPL may extend along the first directionDR1. The initialization power line IPL may have a shape extending fromone to the other of portions of the non-display area PPA, which arelocated at both sides of the display area PXA. The initialization powerline IPL may be located to be spaced apart from the scan lines Si−1, Si,and Si+1. The initialization power line IPL may be applied with theinitialization power source Vint.

The pixels PXL may be provided in the display area PXA on the substrateSUB. The pixels PXL may be connected to the scan lines Si−1, Si, andSi+1, the data lines Dm−1 and Dm, the emission control lines Ei andEi+1, the power line PL, and the initialization power line IPL.

The pixels PXL may include a first pixel, a second pixel, a third pixel,and a fourth pixel. The first pixel may be a pixel connected to the ithscan line Si and an (m−1)th data line Dm−1. The second pixel may be apixel connected to the ith scan line Si and an mth data line Dm. Thethird pixel may be a pixel connected to the (i+1)th scan line Si+1 andthe (m−1)th data line Dm−1. The fourth pixel may be a pixel connected tothe (i+1)th scan line Si+1 and the mth data line Dm.

Each of the pixels PXL may include a first transistor T1, a secondtransistor T2, a third transistor T3, a fourth transistor T4, a fifthtransistor T5, a sixth transistor T6, a seventh transistor T7, a storagecapacitor Cst, and an organic light emitting device OLED.

Hereinafter, a second pixel connected to the ith scan line Si and themth data line Dm will be described in more detail as an example.

The first transistor T1 may include a first gate electrode GE1, thefirst active pattern ACT1, a first source electrode SE1, a first drainelectrode DE1, and a connection line CNL.

The first gate electrode GE1 may be connected to a third drain electrodeDE3 of the third transistor T3 and to a fourth drain electrode DE4 ofthe fourth transistor T4. The connection line CNL may connect betweenthe first gate electrode GE1 and the third and fourth drain electrodesDE3 and DE4. One end of the connection line CNL may be connected to thefirst gate electrode GE1 through a first contact hole CH1, and the otherend of the connection line CNL may be connected to the third and fourthdrain electrodes DE3 and DE4 through a second contact hole CH2.

In an embodiment of the present disclosure, the first active patternACT1, the first source electrode SE1, and the first drain electrode DE1may be formed of a semiconductor layer that is undoped or doped withimpurities. For example, the first source electrode SE1 and the firstdrain electrode DE1 may be formed of a semiconductor layer that is dopedwith impurities, and the active pattern ACT1 may be formed of asemiconductor layer that is undoped with impurities.

The first active pattern ACT1 has a bar shape (e.g., a bar shapeextending in a predetermined direction), and may have a shape in whichit is bent once or more along the extending direction. When viewed on aplane, the first active pattern ACT1 may overlap with the first gateelectrode GE1. As the first active pattern ACT1 is formed to begenerally long, a channel region of the first transistor T1 can beformed to be generally long. Thus, the driving range of a gate voltageapplied to the first transistor T1 can be widened. Accordingly, the grayscale of light emitted from the organic light emitting device OLED canbe minutely or precisely controlled.

The first source electrode SE1 may be connected to one end of the firstactive pattern ACT1. The first source electrode SE1 may be connected toa second drain electrode DE2 of the second transistor T2 and to a fifthdrain electrode DE5 of the fifth transistor T5. The first drainelectrode DE1 may be connected to the other end of the first activepattern ACT1. The first drain electrode DE1 may be connected to a thirdsource electrode SE3 of the third transistor T3 and to a sixth sourceelectrode SE6 of the sixth transistor T6.

The second transistor T2 may include a second gate electrode GE2, asecond active pattern ACT2, and a second source electrode SE2, and thesecond drain electrode DE2.

The second gate electrode GE2 may be connected to the ith scan line Si.The second gate electrode GE2 may be provided as a portion of the ithscan line Si, or may be provided in a shape protruding from the ith scanline Si.

The second active pattern ACT2, the second source electrode SE2, and thesecond drain electrode DE2 may be formed of a semiconductor layer thatis undoped or doped with impurities. For example, the second sourceelectrode SE2 and the second drain electrode DE2 may be formed of asemiconductor layer that is doped with impurities, and the second activepattern ACT2 may be formed of a semiconductor layer that is undoped withimpurities. The second active pattern ACT2 may correspond to a portionoverlapping with the second gate electrode GE2. One end of the secondsource electrode SE2 may be connected to the second active pattern ACT2.The other end of the second source electrode SE2 may be connected to thedata line Dm through a sixth contact hole CH6. One end of the seconddrain electrode DE2 may be connected to the second active pattern ACT2.The other end of the second drain electrode DE2 may be connected to thefirst source electrode SE1 of the first transistor T1 and to the fifthdrain electrode DE5 of the fifth transistor T5.

The third transistor T3 may be provided at the opposite side of thefirst transistor T1 with respect to the data line Dm. That is, withrespect to the first transistor T1, the data line Dm may be provided atone side of the first transistor T1, and the third transistor T3 may beprovided at the other side of the first transistor T1. For example, asshown in FIG. 10 , the data line Dm may be provided at the left side ofthe first transistor T1, and the third transistor T3 may be provided atthe right side of the first transistor T1. In addition, as shown in FIG.11 , the data line Dm may be provided at the right side of the firsttransistor T1, and the third transistor T3 may be provided at the leftside of the first transistor T1.

The third transistor T3 may be provided in a double gate structure so asto reduce or prevent a leakage current. That is, the third transistor T3may include a 3ath transistor T3 a and a 3bth transistor T3 b. The 3athtransistor T3 a may include a 3ath gate electrode GE3 a, a 3ath activepattern ACT3 a, a 3ath source electrode SE3 a, and a 3ath drainelectrode DE3 a. The 3bth transistor T3 b may include a 3bth gateelectrode GE3 b, a 3bth active pattern ACT3 a, a 3bth source electrodeSE3 b, and a 3bth drain electrode DE3 b. Hereinafter, the 3ath gateelectrode GE3 a and the 3bth gate electrode GE3 b are referred to as athird gate electrode GE3, the 3ath active pattern ACT3 a and the 3bthactive pattern ACT3 b are referred to as a third active pattern ACT3,the 3ath source electrode SE3 a and the 3bth source electrode SE3 b arereferred to as the third source electrode SE3, and the 3ath drainelectrode DE3 a and the 3bth drain electrode DE3 b are referred to asthe third drain electrode DE3.

The third gate electrode GE3 may be connected to the ith scan line Si.The third gate electrode GE3 may be provided as a portion of the ithscan line Si, and/or may be provided in a shape protruding from the ithscan line Si. For example, the 3ath gate electrode GE3 a may be providedin a shape protruding from the ith scan line Si, and the 3bth gateelectrode GE3 b may be provided as a portion of the ith scan line Si.

The third active pattern ACT3, the third source electrode SE3, and thethird drain electrode DE3 may be formed of a semiconductor layer that isundoped or doped with impurities. For example, the third sourceelectrode SE3 and the third drain electrode DE3 may be formed of asemiconductor layer that is doped with impurities, and the third activepattern ACT3 may be formed of a semiconductor layer that is undoped withimpurities. The third active pattern ACT3 may correspond to a portionoverlapping with the third gate electrode GE3.

One end of the third source electrode SE3 may be connected to the thirdactive pattern ACT3. The other end of the third source electrode SE3 maybe connected to the first drain electrode DE1 of the first transistor T1and to the sixth source electrode SE6 of the sixth transistor T6. Oneend of the third drain electrode DE3 may be connected to the thirdactive pattern ACT3. The other end of the third drain electrode DE3 maybe connected to the fourth drain electrode DE4 of the fourth transistorT4. Also, the third drain electrode DE3 may be connected to the firstgate electrode GE1 of the first transistor T1 through the connectionline CNL, the second contact hole CH2, and the first contact hole CH1.

The 3ath source electrode SE3 a of the 3ath transistor T3 a and the 3bthdrain electrode DE3 b of the 3bth transistor T3 b may be covered by ashielding pattern SP. The shielding pattern SP shields external lightincident into the 3ath source electrode SE3 a of the 3ath transistor T3a and into the 3bth drain electrode DE3 b of the 3bth transistor T3 b,thereby reducing or preventing light leakage current that may begenerated in the third transistor T3.

The fourth transistor T4 may be provided in a double gate structure soas to reduce or prevent a leakage current. That is, the fourthtransistor T4 may include a 4ath transistor T4 a and a 4bth transistorT4 b. The 4ath transistor T4 a may include a 4ath gate electrode GE4 a,a 4ath active pattern ACT4 a, a 4ath source electrode SE4 a, and a 4athdrain electrode DE4 a, and the 4bth transistor T4 b may include a 4bthgate electrode GE4 b, a 4bth active pattern ACT4 b, a 4bth sourceelectrode SE4 b, and a 4bth drain electrode DE4 b. Hereinafter, the 4athgate electrode GE4 a and the 4bth gate electrode GE4 b are referred toas a fourth gate electrode GE4, the 4ath active pattern ACT4 a and the4bth active pattern ACT4 b are referred to as a fourth active patternACT4, the 4ath source electrode SE4 a and the 4bth source electrode SE4b are referred to as a fourth source electrode SE4, and the 4ath drainelectrode DE4 a and the 4bth drain electrode DE4 b are referred to asthe fourth drain electrode DE4.

The fourth gate electrode GE4 may be connected to the (i−1)th scan lineSi−1. The fourth gate electrode GE4 may be provided as a portion of the(i−1)th scan line Si−1, and/or may be provided in a shape protrudingfrom the (i−1)th scan line Si−1. For example, the 4ath gate electrodeGE4 a may be provided as a portion of the (i−1)th scan line Si−1, andthe 4bth gate electrode GE4 b may be provided in a shape protruding fromthe (i−1)th scan line Si−1.

The fourth active pattern ACT4, the fourth source electrode SE4, and thefourth drain electrode DE4 may be formed of a semiconductor layer thatis undoped or doped with impurities. For example, the fourth sourceelectrode SE4 and the fourth drain electrode DE4 may be formed of asemiconductor layer that is doped with impurities, and the fourth activepattern ACT4 may be formed of a semiconductor layer that is undoped withimpurities. The fourth active pattern ACT4 may correspond to a portionoverlapping with the fourth gate electrode GE4.

One end of the fourth source electrode SE4 may be connected to thefourth active pattern ACT4. The other end of the fourth source electrodeSE4 may be connected to the initialization power line IPL and to aseventh drain electrode DE7 of the seventh transistor T7. An auxiliaryconnection line AUX may be provided between the fourth source electrodeSE4 and the initialization power line IPL. One end of the auxiliaryconnection line AUX may be connected to the fourth source electrode SE4through a ninth contact hole CH9. The other end of the auxiliaryconnection line AUX may be connected to the initialization power lineIPL through an eighth contact hole CH8. One end of the fourth drainelectrode DE4 may be connected to the fourth active pattern ACT4. Theother end of the fourth drain electrode DE4 may be connected to thethird drain electrode DE3 of the third transistor T3. Also, the fourthdrain electrode DE4 may be connected to the first gate electrode GE1 ofthe first transistor T1 through the connection line CNL, the secondcontact hole CH2, and the first contact hole CH1.

The fifth transistor T5 may include a fifth gate electrode GE5, a fifthactive pattern ACT5, a fifth source electrode SE5, and the fifth drainelectrode DE5.

The fifth gate electrode GE5 may be connected to the emission controlline Ei. The fifth gate electrode GE5 may be provided as a portion ofthe emission control line Ei, or may be provided in a shape protrudingfrom the emission control line Ei.

The fifth active pattern ACT, the fifth source electrode SE5, and thefifth drain electrode DE5 may be formed of a semiconductor layer that isundoped or doped with impurities. For example, the fifth sourceelectrode SE5 and the fifth drain electrode DE5 may be formed of asemiconductor layer that is doped with impurities, and the fifth activepattern ACT5 may be formed of a semiconductor layer that is undoped withimpurities. The fifth active pattern ACT5 may correspond to a portionoverlapping with the fifth gate electrode GE5. One end of the fifthsource electrode SE5 may be connected to the fifth active pattern ACT5.The other end of the fifth source electrode SE5 may be connected to thepower line PL through a fifth contact hole CH5. One end of the fifthdrain electrode DE5 may be connected to the fifth active pattern ACT5.The other end of the fifth drain electrode DE5 may be connected to thefirst source electrode SE1 of the first transistor T1 and the seconddrain electrode DE2 of the second transistor T2.

The sixth transistor T6 may include a sixth gate electrode GE6, a sixthactive pattern ACT6, the sixth source electrode SE6, and a sixth drainelectrode DE6.

The sixth gate electrode SE6 may be connected to the emission controlline Ei. The sixth gate electrode SE6 may be provided as a portion ofthe emission control line Ei, or may be provided in a shape protrudingfrom the emission control line Ei.

The sixth active pattern ACT6, the sixth source electrode SE6, and thesixth drain electrode DE6 may be formed of a semiconductor layer that isundoped or doped with impurities. For example, the sixth sourceelectrode SE6 and the sixth drain electrode DE6 may be formed of asemiconductor layer that is doped with impurities, and the sixth activepattern ACT6 may be formed of a semiconductor layer that is undoped withimpurities. The sixth active pattern ACT6 may correspond to a portionoverlapping with the sixth gate electrode GE6. One end of the sixthsource electrode SE6 may be connected to the sixth active pattern ACT6.The other end of the sixth source electrode SE6 may be connected to thefirst drain electrode DE1 of the first transistor T1 and the thirdsource electrode SE3 of the third transistor T3. One end of the sixthdrain electrode DE6 may be connected to the sixth active pattern ACT6.The other end of the sixth drain electrode DE6 may be connected to aseventh source electrode SE7 of the seventh transistor T7 of a pixel PXLconnected to the ith scan line Si.

The seventh transistor T7 may include a seventh gate electrode GE7, aseventh active pattern ACT7, the seventh source electrode SE7, and aseventh drain electrode DE7.

The seventh gate electrode GE7 may be connected to the ith scan line Si.The seventh gate electrode GE7 may be provided as a portion of the ithscan line Si or may be provided in a shape protruding from the ith scanline Si.

The seventh active pattern ACT7, the seventh source electrode SE7, andthe seventh drain electrode DE7 may be formed of a semiconductor layerthat is undoped or doped with impurities. For example, the seventhsource electrode SE7 and the seventh drain electrode DE7 may be formedof a semiconductor layer that is doped with impurities, and the seventhactive layer ACT7 may be formed of a semiconductor layer that is undopedwith impurities. The seventh active pattern ACT7 may correspond to aportion overlapping with the seventh gate electrode GE7. One end of theseventh source electrode SE7 may be connected to the seventh activepattern ACT7. The other end of the seventh source electrode SE7 may beconnected to the sixth drain electrode DE6 of the sixth transistor T6 ofa pixel PXL connected to the ith scan line Si. One end of the seventhdrain electrode DE7 may be connected to the seventh active pattern ACT7.The other end of the seventh drain electrode DE7 may be connected to theinitialization power line IPL. Also, the seventh drain electrode DE7 maybe connected to a fourth source electrode SE4 of the fourth transistorT4. The seventh drain electrode DE7 and the fourth source electrode SE4of the fourth transistor T4 may be connected to the initialization powerline IPL through the auxiliary connection line AUX, the eighth contacthole CH8, and the ninth contact hole CH9.

The storage capacitor Cst may include a lower electrode LE and an upperelectrode UE. The lower electrode LE may be configured as (e.g., as aportion of) the first gate electrode GE1 of the first transistor T1.

When viewed on a plane, the upper electrode UE overlaps with the firstgate electrode GE1, and may cover the lower electrode LE. As theoverlapping area of the upper electrode UE and the lower electrode LE iswidened, the capacitance of the storage capacitor Cst may be increased.In an embodiment of the present disclosure, the upper electrode UE maybe connected to the power line PL through a third contact hole CH3.Therefore, a voltage having the same level as the first power sourceELVDD may be applied to the upper electrode UE. The upper electrode UEmay have an opening OPN in a region including the first contact hole CH1through which the first gate electrode GE1 and the connection line CNLare in contact with each other.

The organic light emitting device OLED may include a first electrode AD,a second electrode CD, and an emitting layer EML provided between thefirst electrode AD and the second electrode CD.

The first electrode AD may be provided in a light emitting areacorresponding to each pixel PXL. The first electrode AD may be connectedto the sixth drain electrode DE6 of the sixth transistor T6 through aseventh contact hole CH7, a tenth contact hole CH10, and a twelfthcontact hole CH12. A first bridge pattern BRP1 may be provided betweenthe seventh contact hole CH7 and the tenth contact hole CH10. A secondbridge pattern BRP2 may be provided between the tenth contact hole CH10and the twelfth contact hole CH12.

The first bridge pattern BRP1 and the second bridge pattern BRP2 mayconnect the sixth drain electrode DE6 to the first electrode AD.Further, the data lines DM and the power lines PL may overlap the firstelectrode AD of at least one of the pixels PXL, which may correspond toan opening defined by the pixel defining layer PDL, as described furtherbelow.

In the present embodiment, the second pixel is described as an example,but the first pixel, the third pixel, and the fourth pixel may have astructure that is similar to that of the second pixel. However,respective data lines, scan lines, and emission control lines, which areconnected to the first pixel, the third pixel, and the fourth pixel, aredifferent from those of the second pixel.

A first dummy part may be provided at one portion of the non-displayarea PPA on the substrate SUB. For example, the first dummy part may beprovided at the longitudinal part of the non-display area PPA adjacentto a pixel PXL at an outermost portion (hereinafter referred to as an“outermost pixel”). That is, the first dummy part may be provided at theopposite side of the outermost pixel(s) PXL with respect to an outermostdata line Dm. For example, the first dummy part may be provided in thenon-display area PPA adjacent to a third transistor T3 of the outermostpixel PXL.

In addition, the distance between the first dummy part and the thirdtransistor T3 of the outermost pixel PXL may be less than that betweenthe third transistor T3 of the outermost pixel PXL and the outermostdata line Dm.

In the first direction, the width of the first dummy part may be lessthan that of each pixel PXL. The first dummy part may have a shapesimilar to that of one portion of the outermost pixel PXL. In moredetail, the first dummy part may include a dummy semiconductor pattern,a dummy shielding pattern DSP, a dummy upper electrode pattern DUE, adummy data line DDL, and a dummy power pattern DPL.

The dummy semiconductor pattern may have a shape extending in adirection parallel to the dummy data line DDL. The dummy semiconductorpattern may include a dummy second source electrode DSE2, a dummy secondactive pattern DACT2, a dummy second drain electrode DDE2, a dummy fifthsource electrode DSE5, a dummy fifth active pattern DACT5, and a dummyfifth drain electrode DDE5. Here, the dummy second source electrode DSE2may have a shape identical or similar to that of the second sourceelectrode SE2. The dummy second active pattern DACT2 may have a shapeidentical or similar to that of the second active pattern ACT2. Thedummy second drain electrode DDE2 may have a shape identical or similarto that of the second drain electrode DE2. The dummy fifth sourceelectrode DSE5 may have a shape identical or similar to that of thefifth source electrode SE5. The dummy fifth active pattern DACT5 mayhave a shape identical or similar to that of the fifth active patternACT5. The dummy fifth drain electrode DDE5 may have a shape identical orsimilar to that of the fifth drain electrode DE5.

The dummy shielding pattern DSP may have a shape identical or similar tothe shielding pattern SP. Like the shielding pattern SP, the dummyshielding pattern DSP may cover at least a portion of the thirdtransistor T3 of the outermost pixel PXL. For example, in the outermostpixel PXL, a 3ath source electrode SE3 a of a 3ath transistor T3 a, anda 3bth drain electrode SE3 b of a 3bth transistor T3 b, may be coveredby the dummy shielding pattern DSP. The dummy shielding pattern DSP maybe electrically connected to the dummy power pattern DPL.

The dummy upper electrode pattern DUE may have a shape similar to thatof the upper electrode UE with the exception of the opening OPN.

The dummy data line DDL may have a shape identical or similar to that ofthe outermost data line Dm. The dummy data line DDL may be connected tothe dummy second source electrode DSE2 through a dummy sixth contacthole DCH6.

The dummy power pattern DPL may have a shape identical or similar tothat of the power line PL. The dummy power pattern DPL may be connectedto the power line PL. Therefore, the first power source ELVDD may besupplied to the dummy power pattern DPL. The dummy active pattern DACT2connected to the dummy data line DDL through sixth contact hole DCH6,and connected to the dummy power line DPL through fifth contact holeDCH5. Further, the dummy data line DDL and the dummy power line DPLmight not overlap the first electrode of any of the pixels, which maycorrespond to an opening defined by the pixel defining layer PDL, asdescribed further below.

The first dummy part may form a parasitic capacitor with the outermostpixel PXL. For example, the first dummy part may form a parasiticcapacitor with a first drain electrode DE1 of a first transistor T1, thethird transistor T3, and a sixth transistor T6 of the outermost pixelPXL. For example, the first dummy part may form a parasitic capacitorwith the 3ath transistor T3 a of the outermost pixel PXL. Also, thefirst dummy part may form a parasitic capacitor with the first drainelectrode DE of the first transistor T1 of the outermost pixel PXL. If aparasitic capacitor is formed between the outermost pixel PXL and thefirst dummy part, it is possible to reduce or prevent the luminance ofthe outermost pixel PXL from being lowered.

In general, the pixel PXL in the display area PXA forms a parasiticcapacitor with the data lines Dm−1 and Dm and the power line PL, whichare adjacent thereto. For example, the first drain electrode DE1 of thefirst transistor T1, the third transistor T3, and the sixth transistorT6 may form a parasitic capacitor with the data lines Dm−1 and Dmadjacent thereto. The parasitic capacitance may have influence oncurrent applied to the organic light emitting device OLED in the pixelPXL.

Meanwhile, when the first dummy part does not exist, the data lines andthe power line (e.g., the dummy data line DDL and the dummy powerpattern DPL), which are adjacent to the outermost pixel PXL, do notexist. Therefore, the outermost pixel PXL cannot form a parasiticcapacitor with the data lines and the power line, which are adjacentthereto. Accordingly, the luminance of an outermost pixel PXL amongpixels PXL connected to one of the scan lines Si−1, Si, and Si+1 (e.g.,the ith scan line Si) may be different from that of the other pixelsPXL.

However, in the present embodiment, the outermost pixel PXL can form aparasitic capacitor with the first dummy part. Thus, the luminance ofthe outermost pixel PXL among the pixels PXL connected to one of thescan lines Si−1, Si, and Si+1 (e.g., the ith scan line Si) can be equalor similar to that of the other pixels PXL. That is, it is possible toreduce or prevent a difference in luminance from occurring between theoutermost pixels PXL and the other pixels PXL among the pixels PXLconnected to the ith scan line Si.

Hereinafter, a structure of the second pixel according to the presentembodiment will be described along a stacking order with reference toFIGS. 4 to 9 .

A semiconductor pattern may be provided on the substrate SUB includingthe display area PXA and the non-display area PPA. The semiconductorpattern may be provided corresponding to an area in which each pixel PXLof the display area PXA is located. The semiconductor pattern mayinclude the first to seventh active patterns ACT1 to ACT7, the first toseventh source electrodes SE1 to SE7, the first to seventh drainelectrodes DE1 to DE7, and the dummy semiconductor pattern. Thesemiconductor pattern may include a semiconductor material.

A buffer layer may be provided between the substrate SUB and thesemiconductor pattern.

The buffer layer may reduce or prevent impurities from being diffusedinto the first to seventh active patterns ACT1 to ACT7 from thesubstrate SUB. The buffer layer may be provided in a single layer, ormay be provided in a multi-layer including at least two layers. Thebuffer layer may include at least one of an organic insulating layer andan inorganic insulating layer. The organic insulating layer may includean organic insulating material that enables light to be transmittedtherethrough. The inorganic insulating layer may include at least one ofsilicon oxide, silicon nitride, and silicon oxynitride. When the bufferlayer is provided as a multi-layer, the layers may include the samematerial, or may include different materials. For example, the inorganicinsulating layer may include a first layer including silicon oxide, anda second layer that is located on the first layer and includes siliconnitride.

A gate insulating layer GI may be provided on the substrate SUB havingthe semiconductor pattern formed thereon. The gate insulating layer GImay include at least one of an organic insulating layer and an inorganicinsulating layer. The organic insulating layer may include an organicinsulating material that enables light to be transmitted therethrough.For example, the organic insulating layer may include at least one ofphotoresist, polyacrylate resin, epoxy resin, phenolic resin, polyamideresin, polyimide resin, unsaturated polyester resin, polyphenylene etherresin, polyphenylene sulfide resin, and benzocyclobutene resin. Theinorganic insulating layer may include at least one of silicon oxide,silicon nitride, and silicon oxynitride.

The (i−1)th scan line Si−1, the ith scan line Si, the (i+1)th scan lineSi+1, the ith emission control line Ei, the (i+1)th emission controlline Ei+1, and the first to seventh gate electrodes GE1 to GE7 may beprovided on the gate insulating layer GI. The first gate electrode GE1may become, or may form part of, the lower electrode LE of the storagecapacitor Cst. The second gate electrode GE2 and the third gateelectrode GE3 may be integrally formed with the ith scan line Si. Thefourth gate electrode GE4 and the seventh gate electrode GE7 may beintegrally formed with the (i−1)th scan line. The fifth gate electrodeGE5 and the sixth gate electrode GE6 may be integrally formed with theith emission control line Ei.

The (i−1)th scan line Si−1, the ith scan line Si, the (i+1)th scan lineSi+1, the ith emission control line Ei, and the (i+1)th emission controlline Ei+1 may have a shape extending to the non-display area PPAadjacent to the outermost pixel PXL.

The (i−1)th scan line Si−1, the ith scan line Si, the (i+1)th scan lineSi+1, the ith emission control line Ei, the (i+1)th emission controlline Ei+1, and the first to seventh gate electrodes GE1 to GE7 mayinclude a metallic material. For example, the (i−1)th scan line Si−1,the ith scan line Si, the (i+1)th scan line Si+1, the ith emissioncontrol line Ei, the (i+1)th emission control line Ei+1, and the firstto seventh gate electrodes GE1 to GE7 may include at least one of gold(Au), silver (Ag), aluminum (Al), molybdenum (Mo), chromium (Cr),titanium (Ti), nickel (Ni), neodymium (Nd), copper (Cu), and any alloythereof. The (i−1)th scan line Si−1, the ith scan line Si, the (i+1)thscan line Si+1, the ith emission control line Ei, the (i+1)th emissioncontrol line Ei+1, and the first to seventh gate electrodes GE1 to GE7may be formed in a single layer, but the present disclosure is notlimited thereto. For example, the (i−1)th scan line Si−1, the ith scanline Si, the (i+1)th scan line Si+1, the ith emission control line Ei,the (i+1)th emission control line Ei+1, and the first to seventh gateelectrodes GE1 to GE7 may be formed in a multi-layer in which two ormore layers are stacked, which include at least one of gold (Au), silver(Ag), aluminum (Al), molybdenum (Mo), chromium (Cr), titanium (Ti),nickel (Ni), neodymium (Nd), copper (Cu), and any alloy thereof.

A first interlayer insulating layer IL1 may be provided on the substrateSUB on which the (i−1)th scan line Si−1, the ith scan line Si, the(i+1)th scan line Si+1, the ith emission control line Ei, the (i+1)themission control line Ei+1, the first to seventh gate electrodes GE1 toGE7, and the like are formed. The first interlayer insulating layer IL1may include at least one of polysiloxane, silicon oxide, siliconnitride, and silicon oxynitride.

The upper electrode UE of the storage capacitor Cst, the shieldingpattern SP, the initialization power line IPL, the dummy shieldingpattern DSP, and the dummy upper electrode pattern DUE may be providedon the first interlayer insulating layer IL1. The upper electrode UE maycover the lower electrode LE. The upper electrode UE along with thelower electrode LE may constitute the storage capacitor Cst with thefirst interlayer insulating layer IL1 interposed therebetween. The upperelectrode UE, the shielding pattern SP, the initialization power lineIPL, the dummy shielding pattern DSP, and the dummy upper electrodepattern DUE may be formed in a single layer or in multi-layer includingat least one of gold (Au), silver (Ag), aluminum (Al), molybdenum (Mo),chromium (Cr), titanium (Ti), nickel (Ni), neodymium (Nd), copper (Cu),and any alloy thereof.

The initialization power line IPL may have a shape extending to thenon-display area PPA adjacent to the outermost pixel PXL.

The shielding pattern SP may overlap with at least a portion of thethird transistor T3. For example, the shielding pattern SP may cover the3ath source electrode SE3 a of the 3ath transistor T3 a, and the 3bthdrain electrode DE3 b of the 3bth transistor T3 b. The shielding patternSP blocks external light incident into the 3ath source electrode SE3 aof the 3ath transistor T3 a and into the 3bth drain electrode DE3 b ofthe 3bth transistor T3 b, thereby reducing or preventing light leakagecurrent that may be generated in the third transistor T3.

A second interlayer insulating layer IL2 may be provided on thesubstrate SUB on which the upper electrode UE, the shielding pattern SP,the initialization power line IPL, the dummy shielding pattern DSP, andthe dummy upper electrode pattern DUE are located.

The second interlayer insulating layer IL2 may include at least one ofan inorganic insulating layer and an organic insulating layer. Forexample, the second interlayer insulating layer IL2 may include at leastone inorganic insulating layer. The inorganic insulating layer mayinclude at least one of silicon oxide, silicon nitride, and siliconoxynitride. Also, the second interlayer insulating layer IL2 may includeat least one organic insulating layer. The organic insulating layer mayinclude at least one of photoresist, polyacrylate resin, epoxy resin,phenolic resin, polyamide resin, polyimide resin, unsaturated polyesterresin, polyphenylene ether resin, polyphenylene sulfide resin, andbenzocyclobutene resin. Also, the second interlayer insulating layer IL2may have a multi-layered structure including at least one inorganicinsulating layer and at least one organic insulating layer.

A first conductive pattern may be provided on the second interlayerinsulating layer IL2. The first conductive pattern may include the datalines Dm−1 and Dm, the connection line CNL, the auxiliary connectionline AUX, the first bridge pattern BRP1, a first power supply line PL1of the power line PL, the dummy data line DDL, and a dummy first powerline DPL1.

The data lines Dm−1 and Dm may be connected to the respective secondsource electrode SE2 through the sixth contact hole CH6 passing throughthe gate insulating layer GI, the first interlayer insulating layer IL1,and the second interlayer insulating layer IL2.

One end of the connection line CNL may be connected to the first gateelectrode GE1 through the first contact hole CH1 passing through thefirst interlayer insulating layer IL1 and the second interlayerinsulating layer IL2. In addition, the other end of the connection lineCNL may be connected to the third drain electrode DE3 and the fourthdrain electrode DE4 through the second contact hole CH2 passing throughthe gate insulating layer GI, the first interlayer insulating layer IL1,and the second interlayer insulating layer IL2.

The auxiliary connection line AUX may be connected to the initializationpower line IPL through the eighth contact hole CH8 passing through thesecond interlayer insulating layer IL2. Also, the auxiliary connectionline AUX may be connected to the fourth source electrode SE4 and theseventh drain electrode DE7 through the ninth contact hole CH9 passingthrough the gate insulating layer GI, the first interlayer insulatinglayer IL1, and the second interlayer insulating layer IL2.

The first bridge pattern BRP1 along with the second bridge pattern BRP2may be a pattern provided as a medium connecting the sixth drainelectrode DE6 to the first electrode AD between the sixth drainelectrode DE6 and the first electrode AD. The first bridge pattern BRP1may be connected to the sixth drain electrode DE6 through the seventhcontact hole CH7 passing through the gate insulating layer GI, the firstinterlayer insulating layer IL1, and the second interlayer insulatinglayer IL2.

The first power supply line PL1 may have a shape extending in onedirection. The first power supply line PL1 may be connected to the fifthsource electrode SE5 through the fifth contact hole CH5 passing throughthe gate insulating layer GI, the first interlayer insulating layer IL1,and the second interlayer insulating layer IL2. Also, the first powersupply line PL1 may be connected to the upper electrode UE through thethird contact hole CH3 passing through the second interlayer insulatinglayer IL2.

The first power supply line PL1 may be electrically connected to theshielding pattern SP through a fourth contact hole CH4 passing throughthe second interlayer insulating layer IL2. Therefore, the shieldingpattern SP may be applied with the same power source as the power linePL. That is, the first power source ELVDD may be applied to theshielding pattern SP.

In addition, the shielding pattern SP of each pixel PXL may be connectedto the first power supply line PL1 of an adjacent pixel PXL in adirection toward the outermost pixel PXL.

The dummy data line DDL may extend in parallel to the data lines Dm−1and Dm. The dummy data line DDL may have a shape identical or similar tothat of the data lines Dm−1 and Dm. The dummy data line DDL may beconnected to the dummy second source electrode DSE2 through the dummysixth contact hole DCH6 passing through the gate insulating layer GI,the first interlayer insulating layer IL1, and the second interlayerinsulating layer IL2.

The dummy first power line DPL1 may have a shape identical or similar tothat of the first power supply line PL1. The dummy first power line DPL1may be connected to the dummy upper electrode pattern DUE and the dummyshielding pattern DSP through a dummy third contact hole DCH3 and adummy fourth contact hole DCH4, which pass through the second interlayerinsulating layer IL2. The dummy first power line DPL1 may be connectedto the dummy fifth source electrode DSE5 through a dummy fifth contacthole DCH5 passing through the gate insulating layer GI, the firstinterlayer insulating layer IL1, and the second interlayer insulatinglayer IL2.

A third interlayer insulating layer IL3 may be provided on the substratehaving the first conductive pattern provided thereon. The thirdinterlayer insulating layer IL3 may include a first insulating layerIL31 provided on the substrate SUB having the first conductive patternprovided thereon, and a second insulating layer IL32 provided on thefirst insulating layer IL31. The first insulating layer IL31 may includean inorganic insulating material. For example, the first insulatinglayer IL31 may include at least one of polysiloxane, silicon oxide,silicon nitride, and silicon oxynitride. For example, the secondinsulating layer IL32 may include at least one of photoresist,polyacrylate resin, epoxy resin, phenolic resin, polyamide resin,polyimide resin, unsaturated polyester resin, polyphenylene ether resin,polyphenylene sulfide resin, and benzocyclobutene resin.

A second conductive pattern may be provided on the third interlayerinsulating layer IL3. The second conductive pattern may include a secondpower supply line PL2 of the power line PL, the second bridge patternBRP2, and a dummy second power line DPL2. The second bridge pattern BRP2may be connected to the first bridge pattern BRP1 through the tenthcontact hole CH10 passing through the first insulating layer IL31 andthe second insulating layer IL32.

The second power supply line PL2 may have a shape in which at least aportion of the second power supply line PL2 overlaps with the firstpower supply line PL1. For example, the second power supply line PL2 mayinclude first lines extending in parallel to the first power supply linePL1 and second lines extending in a direction crossing the first lines.Therefore, the second lines may allow adjacent first lines to beelectrically connected to each other therethrough.

Because the first lines and the second lines cross each other, thesecond power supply line PL2 may have a lattice or mesh shape. The firstlines of the second power supply line PL2 may be connected to the firstpower supply line PL1 through an eleventh contact hole CH11 passingthrough the first insulating layer IL31 and the second insulating layerIL32. Therefore, the power line PL may include the first power supplyline PL1 and the second power supply line PL2.

The power line PL includes the first power supply line PL1 and thesecond power supply line PL2, and the second power line PL2 has thelattice or mesh shape, so that, although a portion of the first powersupply line PL1 or the second power supply line PL2 is opened, the firstpower source ELVDD supplied to the power line PL can detour to besupplied to each pixel PXL. Thus, it is possible to reduce or preventthe generation of a dark spot as the first power supply line PL1 or thesecond power supply line PL2 is opened (e.g., electrically opened, ordisconnected).

In addition, the power line PL includes the first power supply line PL1and the second power supply line PL2, and the second power line PL2 hasthe lattice or mesh shape, so that a voltage drop of the first powersource ELVDD can be reduced or prevented. If the voltage drop of thefirst power source ELVDD is reduced or prevented, the pixels PXL can besupplied with substantially uniform first power source ELVDD, andaccordingly, it is possible to reduce or prevent the quality of thedisplay device from being degraded.

The dummy second power line DPL2 may have a shape identical or similarto that the first lines of the second power supply line PL2. The dummysecond power line DPL2 may be connected to the second lines. Therefore,the dummy second power line DPL2 may be applied with the first powersource ELVDD.

The dummy second power line DPL2 may be connected to the dummy firstpower line DPL1 through a dummy eleventh contact hole DCH11. Therefore,the dummy power pattern DPL may include the dummy first power line DPL1and the dummy second power line DPL2. Because the dummy second powerline DPL2 is connected to the dummy first power line DPL1, the dummyfirst power line DPL1 may be supplied with the first power source ELVDD,and the dummy shielding pattern DSP connected to the dummy first powerline DPL1 may also be supplied with the first power source ELVDD.

A fourth interlayer insulating layer IL4 may be provided on the thirdinterlayer insulating layer IL3 having the second conductive patternprovided thereon.

The fourth interlayer insulating layer IL4 may include an organicinsulating material. For example, the fourth interlayer insulating layerIL4 may include at least one of photoresist, polyacrylate resin, epoxyresin, phenolic resin, polyamide resin, polyimide resin, unsaturatedpolyester resin, polyphenylene ether resin, polyphenylene sulfide resin,and benzocyclobutene resin.

The organic light emitting device OLED may be provided on the fourthinterlayer insulating layer IL4. The organic light emitting device OLEDmay include the first electrode AD, the second electrode CD, and theemitting layer EML provided between the first electrode AD and thesecond electrode CD.

The first electrode AD may be provided on the fourth interlayerinsulating layer IL4. The first electrode AD may be connected to thesecond bridge pattern BRP through the twelfth contact hole CH12 passingthrough the fourth interlayer insulating layer IL4. Therefore, the firstelectrode AD may be electrically connected to the first bridge patternBRP1. Because the first bridge pattern BRP1 is connected to the sixthdrain electrode DE6 through the seventh contact hole CH7, the firstelectrode AD may be electrically connected to the sixth drain electrodeDE6.

A pixel defining layer PDL defining a light emitting area to correspondto each pixel PXL may be provided on the fourth interlayer insulatinglayer IL4 having the first electrode AD formed thereon. The pixeldefining layer PDL may expose a top surface of the first electrode ADtherethrough. The exposed area of the first electrode AD may be a lightemitting area.

The pixel defining layer PDL may include an organic insulating material.For example, the pixel defining layer PDL may include at least one ofpolystyrene, polymethylmethacrylate (PMMA), polyacrylonitrile (PAN),polyimide (PA), polyimide (PI), polyarylether (PAE), heterocyclicpolymer, parylene, epoxy, benzocyclobutene (BCB), siloxane based resin,and silane based resin.

The emitting layer EML may be provided in the light emitting area on thefirst electrode AD, and the second electrode CD may be provided on theemitting layer EML. An encapsulation layer SLM covering the secondelectrode CD may be provided on the second electrode CD.

One of the first electrode AE and the second electrode CE may be ananode, and the other may be a cathode. For example, the first electrodeAE may be an anode and the second electrode CE may be a cathode.

In addition, at least one of the first electrode AD and the secondelectrode CD may be a transmissive electrode. For example, when theorganic light emitting device OLED is a bottom-emission organic lightemitting device, the first electrode AD may be a transmissive electrode,and the second electrode CD may be a reflective electrode. When theorganic light emitting device OLED is a top-emission organic lightemitting device, the first electrode AD may be a reflective electrode,and the second electrode CD may be a transmissive electrode. When theorganic light emitting device OLED is a dual-emission light emittingdevice, both of the first electrode AD and the second electrode CD maybe transmissive electrodes. In this embodiment, a case where the organiclight emitting device OLED is a top-emission organic light emittingdevice, and the first electrode AD is an anode electrode is described asan example.

The first electrode AD may include a reflective layer, which is capableof reflecting light, and a transparent conductive layer that is locatedon the top or bottom of the reflective layer. At least one of thetransparent conductive layer and the reflective layer may beelectrically connected to the sixth drain electrode DE6.

The reflective layer may include a material capable of reflecting light.For example, the reflective layer may include at least one of aluminum(Al), silver (Ag), chromium (Cr), molybdenum (Mo), platinum (Pt), nickel(Ni), and alloys thereof.

The transparent conductive layer may include a transparent conductiveoxide. For example, the transparent conductive layer may include atleast one transparent conductive oxide selected from indium tin oxide(ITO), indium zinc oxide (IZO), aluminum zinc oxide (AZO), gallium dopedzinc oxide (GZO), zinc tin oxide (ZTO), gallium tin oxide (GTO), andfluorine doped tin oxide (FTO).

The emitting layer EML may be located on the light emitting area of thefirst electrode AD. The emitting layer EML may have a multi-layered thinfilm structure at least including a light generation layer (LGL). Forexample, the emitting layer EML may include a hole injection layer (HIL)for injecting holes, a hole transport layer (HTL) having an excellenthole transporting property, the HTL for increasing the opportunity forholes and electrons to be re-combined by suppressing the movement ofelectrons that fail to be combined in the LGL, the LGL for emittinglight through the re-combination of the injected electrons and holes, ahole blocking layer (HBL) for suppressing the movement of holes thatfail to be combined in the LGL, an electron transport layer (ETL)smoothly transporting electrons to the LGL, and an electron injectionlayer (EIL) for injecting electrons. In the emitting layer EML, the HIL,HTL, HBL, ETL, and EIL may be common layers commonly located in pixelsPXL adjacent to each other.

The second electrode CD may be a semi-transmissive reflective layer. Forexample, the second electrode CD may be a thin metal layer having athickness, through which light emitted through the emitting layer EMLcan be transmitted. The second electrode CD may transmit a portion ofthe light emitted from the emitting layer EML therethrough, and mayreflect the rest of the light emitted from the emitting layer EML.

The second electrode CD may include a material having a work functionthat is lower than that of the transparent conductive layer. Forexample, the second electrode CD may be include at least one ofmolybdenum (Mo), tungsten (W), silver (Ag), magnesium (Mg), aluminum(Al), platinum (Pt), palladium (Pd), gold (Au), nickel (Ni), neodymium(Nd), iridium (Ir), chromium (Cr), lithium (Li), calcium (Ca), andalloys thereof.

A portion of the light emitted from the emitting layer EML may not betransmitted through the second electrode CD, and the light reflectedfrom the second electrode CD may be again reflected from the reflectivelayer. That is, the light emitted from the emitting layer EML mayresonate between the reflective layer and the second electrode CD. Thelight extraction efficiency of the organic light emitting device OLEDcan be improved by the resonance of the light.

The distance between the reflective layer and the second electrode CDmay be changed depending on a color of the light emitted from theemitting layer EML. That is, the distance between the reflective layerand the second electrode CD may be adjusted to satisfy constructiveinterference of the light emitted from the emitting layer EML, dependingon a color of the light emitted from the emitting layer EML.

The encapsulation layer SLM can reduce or prevent oxygen and moisturefrom infiltrating into the organic light emitting device OLED. Theencapsulation layer SLM may include a plurality of inorganic layers anda plurality of organic layers. For example, the encapsulation layer SLMmay include a plurality unit encapsulation layers including theinorganic layer and the organic layer located on the inorganic layer. Inaddition, the inorganic layer may be located at the uppermost portion ofthe encapsulation layer SLM. The inorganic layer may include at leastone selected from the group consisting of silicon oxide, siliconnitride, silicon oxynitride, aluminum oxide, titanium oxide, zirconiumoxide, and tin oxide.

FIG. 12 is a plan view illustrating the active patterns, the sourceelectrodes, and the drain electrodes, which are shown in FIGS. 4 to 10 .FIG. 13 is a plan view illustrating the scan lines, the emission controllines, and the lower electrode of the storage capacitor, which are shownin FIGS. 4 to 10 . FIG. 14 is a plan view illustrating theinitialization power line and the upper electrode of the storagecapacitor, which are shown in FIGS. 4 to 10 . FIG. 15 is a plan viewillustrating the data lines, the connection line, the auxiliaryconnection line, the first power supply line of the power line, and thefirst bridge pattern, which are shown in FIGS. 4 to 10 . FIG. 16 is aplan view illustrating the data lines, the second power supply line ofthe power line, the connection line, an extension region, and the secondbridge pattern, which are shown in FIGS. 4 to 10 . FIG. 17 is a planview illustrating the organic light emitting device shown in FIGS. 4 to10 .

Referring to FIGS. 12 to 17 in conjunction with FIGS. 1 to 10 , thesemiconductor pattern may be provided on the substrate SUB. Thesemiconductor pattern may include first to seventh active patterns ACT1to ACT7, the first to seventh source electrode SE1 to SE7, the first toseventh drain electrodes DE1 to DE7, and the dummy semiconductorpattern. The first to seventh active patterns ACT1 to ACT7, the first toseventh source electrode SE1 to SE7, the first to seventh drainelectrodes DE1 to DE7, and the dummy semiconductor pattern may includethe same material, and may be formed through the same process. The firstto seventh active patterns ACT1 to ACT7, the first to seventh sourceelectrode SE1 to SE7, the first to seventh drain electrodes DE1 to DE7,and the dummy semiconductor pattern may include a semiconductormaterial.

One end of the first active pattern ACT1 may be connected to the firstsource electrode SE1, and the other end of the first active pattern ACT1may be connected to the first drain electrode DE1. One end of the secondactive pattern ACT2 may be connected to the second source electrode SE2,and the other end of the second active pattern ACT2 may be connected tothe second drain electrode DE2. One end of the third active pattern ACT3may be connected to the third source electrode SE3, and the other end ofthe third active pattern ACT3 may be connected to the third drainelectrode DE3. One end of the fourth active pattern ACT4 may beconnected to the fourth source electrode SE4, and the other end of thefourth active pattern ACT4 may be connected to the fourth drainelectrode DE4. One end of the fifth active pattern ACT5 may be connectedto the source electrode SE5, and the other end of the fifth activepattern ACT5 may be connected to the fifth drain electrode DE5. One endof the sixth active pattern ACT6 may be connected to the sixth sourceelectrode SE6, and the other end of the sixth active pattern ACT6 may beconnected to the sixth drain electrode DE5. One end of the seventhactive pattern ACT7 may be connected to the seventh source electrodeSE7, and the other end of the seventh active pattern ACT7 may beconnected to the seventh drain electrode DE7.

The dummy semiconductor pattern DSCL may include the dummy second sourceelectrode DSE2, the dummy second active pattern DACT2, the dummy seconddrain electrode DDE2, the dummy fifth source electrode DSE5, the dummyfifth active pattern DACT5, and the dummy fifth drain electrode DDE5.

The gate insulating layer GI may be provided on the semiconductorpattern, and the (i−1)th scan line Si−1, the ith scan line Si, the(i+1)th scan line Si+1, the ith emission control line Ei, the (i+1)themission control line Ei+1, and the first to seventh gate electrodes GE1to GE7 may be provided on the gate insulating layer GI. The (i−1)th scanline Si−1, the ith scan line Si, the (i+1)th scan line Si+1, the ithemission control line Ei, the (i+1)th emission control line Ei+1, andthe first to seventh gate electrodes GE1 to GE7 may include the samematerial and may be formed through the same process.

In the pixels PXL connected to the ith scan line Si, the (i−1)th scanline Si−1, the ith scan line Si, the (i+1)th scan line Si+1, the ithemission control line Ei, and the first to seventh gate electrodes GE1to GE7 may be provided on the gate insulating layer GI. The second gateelectrode GE2 and the third gate electrode GE3 may be integrally formedwith the ith scan line Si. The fourth gate electrode GE4 and the seventhgate electrode GE7 may be integrally formed with the (i−1)th scan lineSi−1. The fifth gate electrode GE5 and the sixth gate electrode GE6 maybe integrally formed with the ith emission control line Ei.

In the pixels PXL connected to the (i+1)th scan line Si+1, the ith scanline Si, the (i+1)th scan line Si+1, the (i+1)th emission control lineEi+1, and the first to seventh gate electrodes GE1 to GE7 may beprovided on the gate insulating layer GI. The second gate electrode GE2and the third gate electrode GE3 may be integrally formed with the(i+1)th scan line Si+1. The fourth gate electrode GE4 and the seventhgate electrode GE7 may be integrally formed with the ith scan line Si.The fifth gate electrode GE5 and the sixth gate electrode GE6 may beintegrally formed with the (i+1)th emission control line Ei+1.

In each pixel PXL, the first gate electrode GE1 may become, or may forma portion of, the lower electrode LE of the storage capacitor Cst.

The first interlayer insulating layer IL1 may be provided over the(i−1)th scan line Si−1, the ith scan line Si, the (i+1)th scan lineSi+1, the ith emission control line Ei, the (i+1)th emission controlline Ei+1, and the first to seventh gate electrodes GE1 to GE7.

The upper electrode UE of the storage capacitor Cst, the shieldingpattern SP, the initialization power line IPL, the dummy shieldingpattern DSP, and the dummy upper electrode pattern DUE may be providedon the first interlayer insulating layer IL1. The upper electrode UE,the shielding pattern SP, the initialization power line IPL, the dummyshielding pattern DSP, and the dummy upper electrode pattern DUE mayinclude the same material and be formed through the same process.

The second interlayer insulating layer IL2 may be provided on the upperelectrode UE of the storage capacitor Cst, the shielding pattern SP, theinitialization power line IPL, the dummy shielding pattern DSP, and thedummy upper electrode pattern DUE.

The first conductive pattern may be provided on the second interlayerinsulating layer IL2. The first conductive pattern may include the datalines Dm−1 and Dm, the connection line CNL, the auxiliary connectionline AUX, the first bridge pattern BRP1, the first power supply line PL1of the power line PL, the dummy data line DDL, and the dummy first powerline DPL1.

The data lines Dm−1 and Dm, the connection line CNL, the auxiliaryconnection line AUX, the first bridge pattern BRP1, the first powersupply line PL1 of the power line PL, the dummy data line DDL, and thedummy first power line DPL1 may include the same material, and may beformed through the same process.

The data lines Dm−1 and Dm may be connected to the second sourceelectrode SE2 through the sixth contact hole CH6 passing through thegate insulating layer GI, the first interlayer insulating layer IL1, andthe second interlayer insulating layer IL2.

The connection line CNL1 may be connected to the first gate electrodethrough the first contact hole CH1 passing through the first interlayerinsulating layer IL1 and the second insulating layer IL2. In addition,the connection line CNL may be connected to the third drain electrodeDE3 and the fourth drain electrode DE4 through the second contact holeCH2 passing through the gate insulating layer GI, the first interlayerinsulating layer IL1, and the second interlayer insulating layer IL2.

The auxiliary connection line AUX may be connected to the initializationpower line IPL through the eighth contact hole CH8 passing through thesecond interlayer insulating layer IL2. Also, the auxiliary connectionline AUX may be connected to the fourth source electrode SE4 and theseventh drain electrode DE7 through the ninth contact hole CH9 passingthrough the gate insulating layer GI, the first interlayer insulatinglayer IL1, and the second interlayer insulating layer IL2.

The first bridge pattern BRP1 may be connected to the sixth drainelectrode DE6 through the seventh contact hole CH7 passing through thegate insulating layer GI, the first interlayer insulating layer IL1, andthe second interlayer insulating layer IL2.

The first power supply line PL1 may be connected to the fifth sourceelectrode SE5 through a fifth contact hole CH5 passing through the gateinsulating layer GI, the first interlayer insulating layer IL1, and thesecond interlayer insulating layer IL2. The first power supply line PL1may be connected to the upper electrode UE through the third contacthole CH3 passing through the second interlayer insulating layer IL2. Thefirst power supply line PL1 may be electrically connected to theshielding pattern SP through the fourth contact hole CH4 passing throughthe second interlayer insulating layer IL2.

The dummy data line DDL may be connected to the dummy second sourceelectrode DSE2 through the dummy sixth contact hole DCH6 passing throughthe gate insulating layer GI, the first interlayer insulating layer IL1,and the second interlayer insulating layer IL2.

The dummy first power line DPL1 may be connected to the dummy upperelectrode pattern DUE and the dummy shielding pattern DSP through thedummy third contact hole DCH3 and the dummy fourth contact hole DCH4,which pass through the second interlayer insulating layer. The dummyfirst power line DPL1 may be connected to the dummy fifth sourceelectrode DSE5 through the dummy fifth contact hole DCH5 passing throughthe gate insulating layer GI, the first interlayer insulating layer IL1,and the second interlayer insulating layer IL2.

The third interlayer insulating layer IL3 may be provided over the firstconductive pattern. The second conductive pattern may be provided on thethird interlayer insulating layer IL3. The second conductive pattern mayinclude the second power supply line PL2 of the power line PL, thesecond bridge pattern BRP2, and the dummy second power line DPL2. Thesecond power supply line PL2 of the power line PL, the second bridgepattern BRP2, and the dummy second power line DPL2 may include the samematerial and may be formed through the same process.

The second bridge pattern BRP2 may be connected to the first bridgepattern BRP1 through the tenth contact hole CH10 passing through thefirst insulating layer IL31 and the second insulating layer IL32.

At least a portion of the second power supply line PL2 may overlap withthe first power supply line PL1. The second power supply line PL2 mayextend in parallel to the data lines Dm−1, Dm, and Dm+1.

The second power supply line PL2 may be connected to the first powersupply line PL1 through the eleventh contact hole CH11 passing throughthe third interlayer insulating layer IL3. For example, the eleventhcontact hole CH11 may be located in an area in which the first powersupply line PL1 and the second power supply line PL2 overlap with eachother, and the first power supply line PL1 and the second power supplyline PL2 may be electrically connected to each other through theeleventh contact hole CH11.

The dummy second power line DPL2 may have a shape identical or similarto a first line PL21 of the second power supply line PL2. The dummysecond power line DPL2 may be connected to a second line PL22 of thesecond power supply line PL2. Therefore, the dummy second power lineDPL2 may be applied with the first power source ELVDD.

The fourth interlayer insulating layer IL4 may be provided over thefourth conductive pattern, and the organic light emitting device OLEDmay be provided on the fourth interlayer insulating layer IL4. Theorganic light emitting device OLED may include the first electrode AD onthe fourth interlayer insulating layer IL4, the emitting layer EML onthe first electrode AD, and the second electrode CD on the emittinglayer EML. The first electrode AD may be connected to the second bridgepattern BRP2 through the twelfth contact hole CH12 passing through thefourth interlayer insulating layer IL4.

FIG. 18 is an enlarged view of area EA2 of FIG. 1 . FIG. 19 is anenlarged view of a second dummy part shown in FIG. 18 . FIG. 20 is across-sectional view taken along the line IV-IV′ of FIG. 19 .

In FIGS. 18 to 20 , for convenience of description, a pixel connected toa kth scan line, a (k+1)th scan line, an (n−1)th data line, and an nthdata line is illustrated as an example.

Referring to FIGS. 1 to 10 and 18 to 20 , the display device may includea substrate SUB including a display area PXA and a non-display area PPA,pixels PXL provided in the display area PXA, and a line unit thatprovides signals to the pixels PXL.

The line unit may provide signals to each of the pixels PXL. The lineunit may include scan lines Sk−1, Sk, and Sk+1, data lines Dn−1 and Dn,emission control lines Ek and Ek+1, a power line PL, and aninitialization power line IPL.

The pixels PXL may be provided in the display area PXA on the substrateSUB. The pixels PXL may be connected to the scan lines Sk−1, Sk, andSk+1, the data lines Dn−1 and Dn, the emission control lines Ek andEk+1, the power line PL, and the initialization power line IPL.

Lengths of the scan lines Sk−1, Sk, and Sk+1, the emission control linesEk and Ek+1, and the initialization power line IPL, which are providedin a first display area PXA1, may be the same. Lengths of the scan linesSk−1, Sk, and Sk+1, the emission control lines Ek and Ek+1, and theinitialization power line IPL, which are provided in a second displayarea PXA2, however, may be respectively shorter than those of the scanlines Sk−1, Sk, and Sk+1, the emission control lines Ek and Ek+1, andthe initialization power line IPL, which are provided in the firstdisplay area PXA1. The lengths of respective ones of the scan linesSk−1, Sk, and Sk+1, the emission control lines Ek and Ek+1, and theinitialization power line IPL, which are provided in the second displayarea PXA2, may decrease as they become more distant from the firstdisplay area PXA1.

A second dummy part may be provided at one portion of the non-displayarea PPA corresponding to the second display area PXA2. For example, thesecond dummy part may be provided in the non-display area PPA adjacentto an outermost pixel(s) PXL of the second display area PXA2. That is,with respect to the outermost pixel PXL, the second dummy part may beprovided at the opposite side of an outermost data line Dn. For example,the second dummy part may be provided in the non-display area PPAadjacent to a third transistor T3 of the outermost pixel PXL.

In addition, the distance between the second dummy part and the thirdtransistor T3 of the outermost pixel PXL may be less than that betweenthe third transistor T3 of the outermost pixel PXL and the outermostdata line Dn.

In the first direction DR1, the width of the second dummy part may beless than that of each pixel PXL.

The second dummy part may include a dummy shielding pattern DSP, a dummydata line DDL, and a dummy first power line DPL1.

The dummy shielding pattern DSP may have a shape identical or similar tothe shielding pattern SP. Like the shielding pattern SP, the dummyshielding pattern DSP may cover at least a portion of the thirdtransistor T3 of the outermost pixel PXL.

The dummy data line DDL may have a shape identical or similar to that ofthe outermost data line Dn. The dummy data line DDL may be connected tothe second dummy source electrode DSE2 through the dummy sixth contacthole DCH6. The dummy data line DDL may have a shape extending from adata line that supplies a data signal to a pixel connected to a scanline adjacent to the display area PXA. That is, the dummy data line DDLof the second dummy part corresponding to the pixel PXL connected to a(k+1) the scan line Sk+1 may have a shape extending from an nth dataline Dn that supplies a data signal to a pixel PXL connected to a kthscan line.

The dummy first power line DPL1 may have a shape identical or similar tothe first power supply line PL1. The dummy first power line DPL1 mayhave a shape extending from the first power supply line PL1 thatsupplies the first power source ELVDD to a pixel connected to a scanline adjacent to the first display area PXA1. That is, the dummy firstpower line DPL1 of the second dummy part corresponding to the pixel PXLconnected to the (k+1)th scan line Sk+1 may have a shape extending fromthe first power supply line PL1 that supplies the first power sourceELVDD to the pixel PXL connected to the kth scan line Sk.

The second dummy part forms a parasitic capacitor with outermost pixelsPXL connected to the outermost data line among the pixels PXL providedin the second display area PXA2 so that it is possible to reduce orprevent a difference in luminance from occurring between pixels PXLconnected to the outermost data lines Dn−1 and Dn and the other pixelsPXL.

According to the present disclosure, the display device includes a dummypart that forms a parasitic capacitor with pixels provided at an edge ofthe display area, so that it is possible to reduce or prevent adifference in luminance from occurring between the pixels. Thus, thedisplay quality of the display device can be improved.

Example embodiments have been disclosed herein, and although specificterms are employed, they are used and are to be interpreted in a genericand descriptive sense only and not for purpose of limitation. In someinstances, as would be apparent to one of ordinary skill in the art asof the filing of the present application, features, characteristics,and/or elements described in connection with a particular embodiment maybe used singly or in combination with features, characteristics, and/orelements described in connection with other embodiments unless otherwisespecifically indicated. Accordingly, it will be understood by those ofskill in the art that various changes in form and details may be madewithout departing from the spirit and scope of the present disclosure asset forth in the following claims.

What is claimed is:
 1. A display device, comprising: pixels each comprising a light emitting element, the light emitting element comprising a first electrode, an emitting layer, and a second electrode; data lines and a dummy data line extending parallel to each other, the data lines being connected to the pixels; and power lines and a dummy power line extending parallel to each other, the power lines being connected to the pixels, wherein, in a plan view, each of the data lines and the power lines overlaps the first electrode of at least one of the pixels, and wherein, in a plan view, the dummy data line and the dummy power line do not overlap the first electrode of any of the pixels.
 2. The display device of claim 1, wherein the dummy power line is connected to the power lines through a connection part extending in a second direction crossing a first direction in which the power lines extend.
 3. The display device of claim 1, wherein each of the power lines comprises: a first power supply line parallel to the data lines; and a second power supply line connected to the first power supply line through a contact hole passing through an insulating layer interposed between the first power supply line and the second power supply line.
 4. The display device of claim 3, wherein the second power supply line comprises first lines parallel to the data lines and second lines connecting adjacent ones of the first lines to each other.
 5. The display device of claim 3, wherein the dummy power line comprises: a dummy first power line located at a same layer as the first power supply line; and a dummy second power line located at a same layer as the second power supply line and electrically connected to the dummy first power line.
 6. The display device of claim 5, wherein each of the pixels further comprises a transistor connected to the light emitting element, a corresponding one of the data lines, and a corresponding one of the power lines, the transistor comprising: an active pattern on a substrate; source and drain electrodes each connected to the active pattern; a gate electrode overlapping with the active pattern with a gate insulating layer interposed therebetween; and an interlayer insulating layer covering the gate electrode, and comprising a first interlayer insulating layer, a second interlayer insulating layer, and a third interlayer insulating layer, which are sequentially stacked, wherein the first power supply line is on the second interlayer insulating layer, and wherein the second power supply line is on the third interlayer insulating layer.
 7. The display device of claim 6, wherein each of the pixels further comprises: a compensation transistor connected to the gate electrode of the transistor, and configured to be turned on when a scan signal is supplied to a corresponding one of scan lines to cause the transistor to be diode-connected; and a shielding pattern on the first interlayer insulating layer, and covering at least a portion of the compensation transistor.
 8. The display device of claim 7, further comprising: a dummy semiconductor pattern at a same layer as the active pattern, extending in parallel to the dummy data line, and connected to the dummy power line; and a dummy shielding pattern on the first interlayer insulating layer, connected to the dummy power line, and covering at least a portion of the compensation transistor of one of the pixels.
 9. The display device of claim 1, wherein: the pixels are located in a display area, and the dummy data line is adjacent to an outermost pixel located at an outermost side of the display area from among the pixels.
 10. The display device of claim 9, wherein: the outermost pixel is connected to an outermost data line of the display area from among the data lines, and the dummy data line forms a parasitic capacitor with the outermost pixel.
 11. A display device, comprising: pixels each comprising a light emitting element; pixel defining layer having openings which define light emitting areas of the pixels; data lines and a dummy data line extending parallel to each other, the data lines being connected to the pixels; and power lines and a dummy power line extending parallel to each other, the power lines being connected to the pixels, wherein the light emitting element comprises a first electrode, an emitting layer, and a second electrode that are located in a corresponding light emitting area from among the light emitting areas, wherein, in a plan view, each of the data lines and the power line overlaps at least one of the openings of the pixel defining layer, and wherein, in a plan view, the dummy data line and the dummy power line do not overlap the openings of the pixel defining layer.
 12. The display device of claim 11, wherein the dummy power line is connected to the power lines through a connection part extending in a second direction crossing a first direction in which the power lines extend.
 13. The display device of claim 11, wherein each of the power lines comprises: a first power supply line parallel to the data lines; and a second power supply line connected to the first power supply line through a contact hole passing through an insulating layer interposed between the first power supply line and the second power supply line.
 14. The display device of claim 13, wherein the second power supply line comprises first lines parallel to the data lines and second lines connecting adjacent ones of the first lines to each other.
 15. The display device of claim 13, wherein the dummy power line comprises: a dummy first power line located at a same layer as the first power supply line; and a dummy second power line located at a same layer as the second power supply line and electrically connected to the dummy first power line.
 16. The display device of claim 15, wherein each of the pixels further comprises a transistor connected to the light emitting element, a corresponding one of the data lines, and a corresponding one of the power lines, the transistor comprising: an active pattern on a substrate; source and drain electrodes each connected to the active pattern; a gate electrode overlapping with the active pattern with a gate insulating layer interposed therebetween; and an interlayer insulating layer covering the gate electrode, and comprising a first interlayer insulating layer, a second interlayer insulating layer, and a third interlayer insulating layer, which are sequentially stacked, wherein the first power supply line is on the second interlayer insulating layer, and wherein the second power supply line is on the third interlayer insulating layer.
 17. The display device of claim 16, wherein each of the pixels further comprises: a compensation transistor connected to the gate electrode of the transistor, and configured to be turned on when a scan signal is supplied to a corresponding one of scan lines to cause the transistor to be diode-connected; and a shielding pattern on the first interlayer insulating layer, and covering at least a portion of the compensation transistor.
 18. The display device of claim 17, further comprising: a dummy semiconductor pattern at a same layer as the active pattern, extending in parallel to the dummy data line, and connected to the dummy power line; and a dummy shielding pattern on the first interlayer insulating layer, connected to the dummy power line, and covering at least a portion of the compensation transistor of one of the pixels.
 19. A display device, comprising: pixels each comprising a transistor and a light emitting element connected to the transistor, the transistor comprising an active pattern; data lines connected to the transistor of each of the pixels; power lines connected to the transistor of each of the pixels; a dummy data line extending parallel to the data lines; a dummy power line extending parallel to the power lines; and a dummy active pattern connected to the dummy data line and the dummy power line.
 20. The display device of claim 19, wherein the dummy active pattern is located at a same layer as the active pattern, and extends in parallel to the dummy data line. 